Control of stress and microstructure in cathodic arc deposited films

IEEE Transactions on Plasma Science

Volumn 31, Issue 5 I, 2003, Pages 939-944

  Bilek, Marcela M M ^a   Tarrant, Richard N ^a   McKenzie, D R ^a   Lim, Sunnie H N ^b   McCulloch, Dougal G ^b  

^a UNIVERSITY OF SYDNEY   (Australia)

^b RMIT UNIVERSITY   (Australia)

Author keywords

Carbon; Intrinsic stress; Plasma immersion ion implantation; Preferred orientation; Titanium nitride

Indexed keywords

COMPRESSIVE STRESS; COMPUTER SIMULATION; CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; DEPOSITION; ION BOMBARDMENT; MATHEMATICAL MODELS; MOLECULAR DYNAMICS; STRESS RELAXATION; TITANIUM NITRIDE; YIELD STRESS;

CATHODIC ARC DEPOSITED FILMS; CATHODIC ARC PLASMA; INTRINSIC STRESS; PLASMA IMMERSION ION IMPLANTATION;

ELECTRIC ARCS;

EID: 0242292093     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2003.818409     Document Type: Article

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