-
1
-
-
33845652852
-
-
Washington, DC: U.S. Dept. Commerce
-
P. S. Lederer, Sensor Handbook for Automatic Test, Monitoring, Diagnostic and Control Systems Applications to Military Vehicles and Machinery, vol. 615. Washington, DC: U.S. Dept. Commerce, 1981.
-
(1981)
Sensor Handbook for Automatic Test, Monitoring, Diagnostic and Control Systems Applications to Military Vehicles and Machinery
, vol.615
-
-
Lederer, P.S.1
-
2
-
-
0032680769
-
Silicon compatible materials for harsh environment sensors
-
Apr.
-
G. H. Kroetz, M. H. Eickhoff, and H. Moeller, "Silicon compatible materials for harsh environment sensors," Sens. Actuators A, Phys., vol. 74, no. 1-3, pp. 182-189, Apr. 1999.
-
(1999)
Sens. Actuators A, Phys.
, vol.74
, Issue.1-3
, pp. 182-189
-
-
Kroetz, G.H.1
Eickhoff, M.H.2
Moeller, H.3
-
3
-
-
0345148497
-
Thermal errors in media-separating housings of pressure sensors
-
Jun.
-
V. Stankevic and C. Simkevicius, "Thermal errors in media-separating housings of pressure sensors," Sens. Actuators A, Phys., vol. 75, no. 3, pp. 215-221, Jun. 1999.
-
(1999)
Sens. Actuators A, Phys.
, vol.75
, Issue.3
, pp. 215-221
-
-
Stankevic, V.1
Simkevicius, C.2
-
4
-
-
0026476186
-
Polysilicon as a material for microsensor applications
-
Jan.
-
E. Obermeier and P. Kopystynski, "Polysilicon as a material for microsensor applications," Sens. Actuators A, Phys., vol. 30, no. 1/2, pp. 149-155, Jan. 1992.
-
(1992)
Sens. Actuators A, Phys.
, vol.30
, Issue.1-2
, pp. 149-155
-
-
Obermeier, E.1
Kopystynski, P.2
-
8
-
-
0032308176
-
Application of aluminum films as temperature sensors for the compensation of output thermal shift of polysilicon piezoresistive pressure sensors
-
Dec.
-
V. Stankevic and C. Simkevicius, "Application of aluminum films as temperature sensors for the compensation of output thermal shift of polysilicon piezoresistive pressure sensors." Sens. Actuators A, Phys., vol. 71, no. 3, pp. 161-166, Dec. 1998.
-
(1998)
Sens. Actuators A, Phys.
, vol.71
, Issue.3
, pp. 161-166
-
-
Stankevic, V.1
Simkevicius, C.2
-
9
-
-
33845634535
-
A study of electro-migration performance in a range of Al/Si/Ti Alloys
-
Pennington, NJ: Electrochemical Society
-
N. P. Armstrong, R. J. Dulniak, and R. J. Turnbull, "A study of electro-migration performance in a range of Al/Si/Ti Alloys," in Reliability of Semiconductor Devices and Interconnection and Multilevel Metalization, vol. 89-6. Pennington, NJ: Electrochemical Society, 1989.
-
(1989)
Reliability of Semiconductor Devices and Interconnection and Multilevel Metalization
, vol.89
, Issue.6
-
-
Armstrong, N.P.1
Dulniak, R.J.2
Turnbull, R.J.3
-
10
-
-
0019081768
-
Dopant segregation in polycrystalline silicon
-
Nov.
-
M. M. Mandurah, K. C. Saraswat, C. R. Helms, and T. I. Kamins, "Dopant segregation in polycrystalline silicon," J. Appl. Phys., vol. 51, no. 11, pp. 5755-5763, Nov. 1980.
-
(1980)
J. Appl. Phys.
, vol.51
, Issue.11
, pp. 5755-5763
-
-
Mandurah, M.M.1
Saraswat, K.C.2
Helms, C.R.3
Kamins, T.I.4
-
11
-
-
0026188346
-
Piezoresistive pressure sensors based on polycrystalline silicon
-
Jul.
-
V. Mosser, J. Suski, J. Goss, and E. Obermeier, "Piezoresistive pressure sensors based on polycrystalline silicon," Sens. Actuators A, Phys., vol. 28, no. 2, pp. 113-132, Jul. 1991.
-
(1991)
Sens. Actuators A, Phys.
, vol.28
, Issue.2
, pp. 113-132
-
-
Mosser, V.1
Suski, J.2
Goss, J.3
Obermeier, E.4
-
12
-
-
27944447200
-
Reliability improvement of high value doped polysilicon-based resistors
-
Sep.
-
E. Carvou, F. Le Bihan, A. C. Salaun, R. Rogel, O. Bonnaud, Y. Rey-Tauriac, X. Gagnard, and L. Roland, "Reliability improvement of high value doped polysilicon-based resistors," Microelectron. Reliab., vol. 42, no. 9, pp. 1369-1372, Sep. 2002.
-
(2002)
Microelectron. Reliab.
, vol.42
, Issue.9
, pp. 1369-1372
-
-
Carvou, E.1
Le Bihan, F.2
Salaun, A.C.3
Rogel, R.4
Bonnaud, O.5
Rey-Tauriac, Y.6
Gagnard, X.7
Roland, L.8
-
13
-
-
27944508613
-
Contact resistance: A review of recent developments in measurement and modeling
-
Pennington, NJ: Electrochemical Society
-
S. E. Swirhun, "Contact resistance: A review of recent developments in measurement and modeling," in Reliability of Semiconductor Devices and Interconnection and Multilevel Metalization, vol. 89-6. Pennington, NJ: Electrochemical Society, 1989.
-
(1989)
Reliability of Semiconductor Devices and Interconnection and Multilevel Metalization
, vol.89
, Issue.6
-
-
Swirhun, S.E.1
-
15
-
-
0029542638
-
Reliability problems of polysilicon/Al contacts due to grain-boundary enhanced thermomigration effects
-
Dec.
-
T. Manku and J. H. Orchard-Webb, "Reliability problems of polysilicon/Al contacts due to grain-boundary enhanced thermomigration effects," IEEE Trans. Rel., vol. 44, no. 4, pp. 550-555, Dec. 1995.
-
(1995)
IEEE Trans. Rel.
, vol.44
, Issue.4
, pp. 550-555
-
-
Manku, T.1
Orchard-Webb, J.H.2
-
16
-
-
0031996507
-
Suicides and ohmic contacts
-
J. P. Gambino and E. G. Colgan, "Suicides and ohmic contacts," Mater. Chem. Phys., vol. 52, no. 2, pp. 99-146, 1998.
-
(1998)
Mater. Chem. Phys.
, vol.52
, Issue.2
, pp. 99-146
-
-
Gambino, J.P.1
Colgan, E.G.2
|