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Volumn 75, Issue 3, 1999, Pages 215-221

Thermal errors in media-separating housings of pressure sensors

Author keywords

[No Author keywords available]

Indexed keywords

MICROPROCESSOR CHIPS; PRESSURE TRANSDUCERS; SYSTEMATIC ERRORS;

EID: 0345148497     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00278-7     Document Type: Article
Times cited : (2)

References (9)
  • 1
    • 85031616924 scopus 로고    scopus 로고
    • Sensor, Germany Patent 3313259 (1984).
    • Sensor, Germany Patent 3313259 (1984).
  • 4
    • 0029350539 scopus 로고
    • Low-temperature silicon direct bonding and interface behaviours
    • Jiao J., Lu D., Xiong B., Wang W. Low-temperature silicon direct bonding and interface behaviours. Sensors and Actuators A. 50:1995;117-120.
    • (1995) Sensors and Actuators a , vol.50 , pp. 117-120
    • Jiao, J.1    Lu, D.2    Xiong, B.3    Wang, W.4
  • 9
    • 0030372155 scopus 로고    scopus 로고
    • Theoretical model of performance of a silicon piezoresistive pressure sensor
    • Perraud E. Theoretical model of performance of a silicon piezoresistive pressure sensor. Sensors and Actuators A. 57:1996;245-252.
    • (1996) Sensors and Actuators a , vol.57 , pp. 245-252
    • Perraud, E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.