Thermal development, modeling and characterization of the cell processor module

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 289-296

  Wakil, Jamil ^b   Questad, David ^a   Gaynes, Michael ^a   Hamann, Hendrik ^a   Weger, Alan ^a   Wang, Michael ^a   Harvey, Paul ^a   Yarmchuk, Edward ^a   Coffin, Jeffrey ^a   Yazawa, Kazuaki ^c   Tamura, Tetsuji ^c   Takiguchi, Iwao ^c   Aoki, Hideo ^d  

^a IBM   (United States)

^b Sony Computer Entertainment Inc ^*  (United States)

^c Sony Computer Entertainment Inc   (United States)

^d TOSHIBA CORPORATION   (Japan)

Author keywords

Cell processor; Interface resistance; Package; Power; Thermal

Indexed keywords

BANDWIDTH; ELECTRONICS PACKAGING; HEAT FLUX; HEAT RESISTANCE; PRODUCT DESIGN; RELIABILITY THEORY;

CELL PROCESSORS; INTERFACE RESISTANCE; OPTIMAL PACKAGE THERMAL DESIGN; THERMAL INTERFACE MATERIAL (TIM);

POWER ELECTRONICS;

EID: 33845594385     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645355     Document Type: Conference Paper

References (10)

1. J. Wakil, "Impact of Heat Spreading Lids on Flip Chip Thermal Performance" Proceedings, 2003 IMAPS Conference, Nov. 2003.
2. C. Lasance, "The Influence of Various Common Assumptions on the Boundary-condition-independence of Compact Thermal Models" IEEE Transactions on Components and Packaging Technologies, Sept 2004
3. M. Renzc, et al, "Boundary Condition Independent Dynamic Compact Models of Packages and Heat Sinks From Thermal Transient Measurements", Proceedings 2003 EPTC Conference, Dec. 2003.
4. R. Chaudhry, "A Cycle Accurate Power Estimation Tool" to be published in Proceedings of the Asia and South Pacific Design Automation Conference, 2006.
5. H.F. Hamann, "Spatially Resolved Imaging of Microprocessor Power", ISSCC Dig. Tech. Papers, pp.16, Feb., 2005.
6. S. Guha, H.F. Hamann, J.A. Lacey, M. McGlashan-Powell, M.P. O'Boyle, R.J. von Gutfeld, "Transparent Cooling Duct", US Patent application 20050094706, 2005.
7. A.J. Weger, J.A. Wakil, R.J von Gutfeld, H.F, Hamann, , J.A. Lacey, M.P. O'Boyle, "Method and System for Measuring Temperature and Power Distributions of a Device in a Package", IBM Patent Disclosure YOR920040297US1
8. H.F. Hamann, J. Lacey, A. Weger, J. Wakil, "Spatially-resolved Imaging of Microprocessor Power (SIMP): Hotspots in Microprocessors", ITERM 2006 (accepted)
9. H. F. Hamann, A. Weger, J. Lacey, E. Cohen, C. Atherton, "Power Distribution Measurements of the PowerPC™970MP Microprocessor, ISSCC Dig. Tech. Papers, Feb. 2006 (accepted for publication)
10. S. Dal, "Degradation Mechanisms of Siloxane-based Thermal Interface Materials Under Reliability Stress Conditions", 42nd Reliability Physics Symposium, 2004, pp. 537-542.