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Volumn 27, Issue 3, 2004, Pages 523-529

The influence of various common assumptions on the boundary-condition-independence of compact thermal models

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; FORCED CONVECTION; HEAT FLUX; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; NATURAL CONVECTION;

EID: 4444288542     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831788     Document Type: Article
Times cited : (11)

References (11)
  • 1
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    • A novel approach for the thermal characterization of electronic parts
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    • C. Lasance, H. Vinke, H. Rosten, and K.-L. Weiner, "A novel approach for the thermal characterization of electronic parts," in Proc. SEMITHERM XI, San Jose, CA, 1995, pp. 1-9.
    • (1995) Proc. SEMITHERM XI , pp. 1-9
    • Lasance, C.1    Vinke, H.2    Rosten, H.3    Weiner, K.-L.4
  • 2
    • 0038819109 scopus 로고    scopus 로고
    • Thermal compact models: An alternative approach
    • June
    • E. Bosch, "Thermal compact models: an alternative approach," IEEE Trans. Comp. Packag. Technol., vol. 26, pp. 173-178, June 2003.
    • (2003) IEEE Trans. Comp. Packag. Technol. , vol.26 , pp. 173-178
    • Bosch, E.1
  • 3
    • 0037804762 scopus 로고    scopus 로고
    • Compact thermal models for electronic systems
    • June
    • N. Sabry, "Compact thermal models for electronic systems," IEEE Trans. Comp. Packag. Technol., vol. 26, pp. 179-185, June 2003.
    • (2003) IEEE Trans. Comp. Packag. Technol. , vol.26 , pp. 179-185
    • Sabry, N.1
  • 4
    • 0036218158 scopus 로고    scopus 로고
    • Thermal compact models for electronic systems
    • San Jose, CA
    • E. Bosch and N. Sabry, "Thermal compact models for electronic systems," in Proc. SEMITHERM XVIII, San Jose, CA, 2002, pp. 21-29.
    • (2002) Proc. SEMITHERM XVIII , pp. 21-29
    • Bosch, E.1    Sabry, N.2
  • 5
    • 0036768037 scopus 로고    scopus 로고
    • The conceivable accuracy of experimental and numerical thermal analyzes of electronic systems, appendix C
    • Sept
    • C. Lasance, "The conceivable accuracy of experimental and numerical thermal analyzes of electronic systems, appendix C," IEEE Trans. Comp. Packag. Technol., vol. 25, pp. 366-382, Sept. 2002.
    • (2002) IEEE Trans. Comp. Packag. Technol. , vol.25 , pp. 366-382
    • Lasance, C.1
  • 6
    • 0035691804 scopus 로고    scopus 로고
    • Two benchmarks to facilitate the study of compact thermal modeling phenomena
    • Dec
    • C. Lasance, "Two benchmarks to facilitate the study of compact thermal modeling phenomena," IEEE Trans. Comp. Packag. Technol., vol. 24, pp. 559-566, Dec. 2001.
    • (2001) IEEE Trans. Comp. Packag. Technol. , vol.24 , pp. 559-566
    • Lasance, C.1
  • 7
    • 0031336236 scopus 로고    scopus 로고
    • Compact models for accurate thermal characterization of electronic parts
    • Dec
    • H. Vinke and C. Lasance, "Compact models for accurate thermal characterization of electronic parts," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 20, pp. 411-419, Dec. 1997.
    • (1997) IEEE Trans. Comp., Packag., Manufact. Technol. A , vol.20 , pp. 411-419
    • Vinke, H.1    Lasance, C.2
  • 8
    • 0003063526 scopus 로고    scopus 로고
    • The accuracy of BCI compact thermal models for nonuniformly distributed boundary conditions
    • C. Lasance, "The accuracy of BCI compact thermal models for nonuniformly distributed boundary conditions," in Proc. 8th THERMINIC Workshop, 2002, pp. 251-259.
    • (2002) Proc. 8th THERMINIC Workshop , pp. 251-259
    • Lasance, C.1
  • 10
    • 0032676548 scopus 로고    scopus 로고
    • Creation and evaluation of compact models for thermal characterization using dedicated optimization software
    • San Diego, CA
    • C. Lasance, D. den Hertog, and P. Stehouwer, "Creation and evaluation of compact models for thermal characterization using dedicated optimization software," in Proc. SEMITHERM XV, San Diego, CA, 1999, pp. 189-200.
    • (1999) Proc. SEMITHERM , vol.15 , pp. 189-200
    • Lasance, C.1    den Hertog, D.2    Stehouwer, P.3
  • 11
    • 0037272227 scopus 로고    scopus 로고
    • On the performance of compact thermal models of electronic chip packages in conjugate hoard level simulation
    • San Jose, CA
    • J. Devoe and A. Ortega, "On the performance of compact thermal models of electronic chip packages in conjugate hoard level simulation," in Proc. SEMITHERM XIX, San Jose, CA, 2003, pp.
    • (2003) Proc. SEMITHERM , vol.19 , pp. 313-318
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.