Degradation mechanisms of siloxane-based thermal interface materials under reliability stress conditions

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2004, Pages 537-542

  Dal, Sheila Liza B ^a  

^a Intel Technology Philippines Inc   (Philippines)

Author keywords

Degradation; Reliability stress; Siloxane; Thermal interface material

Indexed keywords

CHEMICAL REACTIONS; DEGRADATION; HYDROPHOBICITY; RELIABILITY; SEMICONDUCTOR MATERIALS; STRESS ANALYSIS; SURFACE TENSION; THERMAL CONDUCTIVITY; THERMODYNAMIC STABILITY;

RELIABILITY STRESS; SILOXANE; THERMAL INTERFACE MATERIALS (TIM);

ELECTRONICS PACKAGING;

EID: 3042615068     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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