Combined thermal and thermomechanical modeling for a multi-chip QFN package with metal-core printed circuit board

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 377-382

  Fan, Xuejun ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Compact model; Fatigue; Finite element; Metal core board; MOSFET; Multi chip module (MCM); Quad flat no lead (QFN); Reliability; Solder joint; Thermal; Visco plastic

Indexed keywords

COMPACT MODELS; MULTI-CHIP MODULE (MCM); QUAD FLAT NO-LEAD (QFN);

FINITE ELEMENT METHOD; LEAD; MICROPROCESSOR CHIPS; MOSFET DEVICES; PRINTED CIRCUIT BOARDS; TEMPERATURE DISTRIBUTION; THERMOMECHANICAL TREATMENT; VISCOPLASTICITY;

ELECTRONICS PACKAGING;

EID: 4444274631     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Philips Semiconductors, PIP201-12M: DC to DC converter powertrain: preliminary data sheet, Rev. 01-23, January 2002.
2. th ASME/IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 1102-1108, June 2002.
3. th IEEE Semiconductor Thermal Measurement and Management Conference, San Jose, CA, 144-150, March 2003.
4. Clemens J. M. Lasance, Hervey I. Rosten & John D. Parry, The world of thermal characterization according to DELPHI-part II: experimental and numerical methods, IEEE Transactions CPMT, 20(4), 392-398.
5. Sarang Shidore & Tien Yu Tom Lee, A comparative study of the performance of compact model topologies and their implementation in CFD for a plastic ball grid array package, ASME Journal of Electronic Packaging, 123(3), 232-237, 2001.
6. Darveaux, R., Effect of Simulation Methodology on Solder Joint Crack Growth Correlation, ECTC Conference Proceedings, 2000.
7. rd International Conference on Thermal & Mechanical Simulation in Micro-Electronics, 29-37, Paris, France, April, 2002.