Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 69-73

  Aggarwal, Ankur O ^a   Raj, P Markondeya ^a   Abothu, Isaac R ^a   Ravi, D ^a   Sacks, Michael D ^b   Tay, Andrew A O ^c   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BUMPLESS; LEAD-FREE SOLDERS; MATERIAL SYNTHESIS; MEMS;

BONDING; COMPOSITION; COPPER COMPOUNDS; DEPOSITION; ELECTROLESS PLATING; HEAT TREATMENT; HERMETIC DEVICES; INTEGRATED CIRCUITS; INTERCONNECTION NETWORKS; LEAD DEPOSITS; MATERIALS; NANOSTRUCTURED MATERIALS; ORGANIC POLYMERS; SOL-GELS; SOLDERING; SYNTHESIS (CHEMICAL);

THIN FILMS;

EID: 2442619216     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. International Technology Roadmap for Semiconductors - Assembly and packaging (2003 edition); http://public.itrs.net/Files/2003ITRS/Home2003.htm
2. L.L. Ye, Z. H. Lai, J. Liu and A. Thölen; "Recent achievement in microstructure investigation of SnO.5Cu3.5Ag lead-free alloy by adding boron and zirconium"; Proceedings of the IMAPS/IEEE-CPMT 4th Symposium on Materials in Electronic Packaging, March 15- 17th, 1999, Braselton, GA, USA, pp. .262-267
3. C. Jeffrey Brinker, George W. Scherer, Sol-gel science: the physics and chemistry of sol-gel processing;; Boston : Academic Press, c1990.
4. L.B. Pankratz; Thermodynamic properties of elements and oxides; U.S. Dept. of the Interior, Bureau of Mines (1982); Bulletin 672