Experiments and modeling of multilayer copper minichannel heat sinks in single-phase flow

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 9-18

  Lei, N ^a   Skandakumaran, P ^a   Ortega, A ^a  

^a University of Arizona   (United States)

Author keywords

Cold plate; Liquid cooling; Microchannel; Minichannel; Multilayer; Stacked

Indexed keywords

COLD PLATES; LIQUID COOLING; MICROCHANNELS; MINICHANNELS;

ASPECT RATIO; CHANNEL FLOW; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS;

ELECTRONIC EQUIPMENT;

EID: 33845570200     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645318     Document Type: Conference Paper

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