Stacked microchannel heat sinks for liquid cooling of microelectronic components

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-V, Issue , 2000, Pages 329-337

  Wei, X ^a   Joshi, Y ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; FLOW OF WATER; MICROCHANNELS; MICROELECTRONICS; NUMERICAL METHODS;

COMPUTATIONALLY EFFICIENT; HEAT REMOVAL; LIQUID COOLED; LIQUID COOLING; MICRO CHANNEL HEAT SINKS; MICROELECTRONIC COMPONENTS; MULTIGRID METHODS; MULTILAYER STACKS; PUMPING POWER; SINGLE LAYER;

HEAT SINKS;

EID: 5444226158     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1537     Document Type: Conference Paper

References (8)

1. Tang L and Joshi Y., 1999, "Application of Block-Implicit Multigrid Approach to three-Dimensional Heat Transfer Problems Involving Discrete Heating", Numerical Heat Transfer, Part A, 35, 7, 717.
2. Tuckerman D.B., Pease R.F.W., 1981, "High-perfonnance Heat Sinking for VLSI", IEEE Electronic Device Letters, 2, 5,126-129
3. Phillips R.J., 1990 "Microchannel Heat Sinks", Advances in Thermal Modeling of Electronic Components and Systems, Bar-Cohen A. & Kraus AD, eds., 2,109-184
4. Weisberg A., Bau H.H. and Zemel J.N., 1992, "Analysis of Microchannels for Integrated Cooling", Int. J. Heat Mass Transfer, 35, 10,2465-74
5. Bau H.H., 1998 "Optimization of Conduits' Shape in Micro Heat Exchangers", Int. J Heat Mass Transfer, 41,2717-23 [6] Vafai K. and Zhu L., 1999, "Analysis of Two-layered Microchannel Heat Sink Concept in Electronic Cooling", Int. J. Heat Mass transfer, 42, 2287-97
6. Biber R. C., Belady L. C., 1997, "Pressure Drop Prediction for Heat Sinks: What Is the Best Method?", Advances in Electronic Packaging, Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 2, 1829-1835.
7. Shah R. K., London A. L., 1978. "Laminar Flow Forced Convection in Ducts", Supplement 1 in Advances in Heat Transfer, Irvine T. F., and Hartnett J. P., eds., Academic, New York.
8. Yin X.and Bau H.H., 1997, "Uniform Channel Micro Heat Exchangers", J. Electronic Packaging, 119, 89-94