Heat transfer in water-cooled silicon carbide milli-channel heat sinks for high power electronic applications

Journal of Heat Transfer

Volumn 127, Issue 1, 2005, Pages 59-65

  Bower, C ^a   Ortega, A ^a   Skandakumaran, P ^a   Vaidyanathan, R ^b   Phillips, T ^b  

^a UNIVERSITY OF ARIZONA   (United States)

^b Advanced Ceramics Research   (United States)

Author keywords

Extrusion freeform fabrication; IGBT cooling; Liquid cooling; Milli Channel; SiC

Indexed keywords

ELECTRONIC EQUIPMENT; FLOW OF FLUIDS; FRICTION; HEAT EXCHANGERS; HEAT TRANSFER; LAMINAR FLOW; POROSITY; REYNOLDS NUMBER; SILICON CARBIDE;

EXTRUSION FREEFORM FABRICATION (EFF); FRICTION COEFFICIENTS; LAMINAR THEORY; SINGLE CHANNEL ROW;

HEAT SINKS;

COOLING; ELECTRONICS INDUSTRY; HEAT TRANSFER; WATER;

EID: 15044366275     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1852494     Document Type: Article

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