Influence of solder volume on interfacial reaction between Sn-Ag-Cu solder and TiW/Cu/Ni UBM

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 492-496

  Wong, C K ^a   Pang, John H L ^b   Sun, Y F ^a   Ng, F L ^a   Tew, J W ^a   Fan, W ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; GROWTH KINETICS; INTERMETALLICS; REACTION KINETICS; RELIABILITY; SHEAR STRENGTH; SILICON WAFERS;

INTERCONNECTION RELIABILITY; ISOTHERMAL AGING; SOLDER BUMP INTERCONNECTION;

SOLDERING ALLOYS;

EID: 33847269754     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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