Thermal based optimization of functional block distributions in a nonuniformly powered die

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 675-682

  Kaisare, Abhijit ^a   Agonafer, Dereje ^a   Haji shiekh, A ^a   Chrysler, Greg ^b   Mahajan, Ravi ^b  

^a The University of Texas at Arlington   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER ARCHITECTURE; FINITE ELEMENT METHOD; MATRIX ALGEBRA; OPTIMIZATION;

FUNCTIONAL BLOCKS; OPTIMAL DISTRIBUTION;

MICROPROCESSOR CHIPS;

EID: 32844474812     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73486     Document Type: Conference Paper

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