Thermal modeling and measurement of large high power silicon devices with asymmetric power distribution

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 300-305

  Deeney, Jeffrey ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

Flip chip; PA RISC; Thermal measurements; Thermal modeling

Indexed keywords

FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SEMICONDUCTING SILICON; SEMICONDUCTOR JUNCTIONS; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS;

ASYMMETRIC POWER DISTRIBUTION; TEMPERATURE GRADIENTS; THERMAL MODELING;

SEMICONDUCTOR DEVICES;

EID: 0036453574     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Douglas A. Puckness, Kamran Eshraghian, "Basic VLSI Design", Prentice Hall, 3rd edition, Chapter, 6, pp 188-189,1994.
2. J. Yetter, et al, "A 15 MIPS 32 b microprocessor", Proceedings of the 1987 IEEE International Solid-State Circuits Conference, Coral Gables, Florida, Feb 1987.
3. N. Gaddis, J. Lotz, "IEEE Journal of Solid-State Circuits vol.31, no.11, p1697-1702, Nov. 1996.
4. P. Barnes, "A 500MHz 64b RISC CPU with 1.5 MB on-chip cache", Proceedings of the 1999 IEEE International Solid-State Circuits Conference, P.86-7, San Francisco, CA, Feb. 1999.
5. S. Shidore, "A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package", Components and Packaging Technologies, Vol 24, pp 191-198, June, 2001.
6. H. Rosten and C.J.M. Lasance, "The Development of libraries of thermal models of electronics components for an integrated design environment", Proceedings IEPS, pp 138-147, Atlanta GA, 1994.
7. Wagner, Guy, "Development of a Compact, High efficiency Cooling device for the PA8000 Processors." 1997 Proceedings International Systems Packaging Symposium, pp.267-271.
8. Wagner, Guy, P. Rose, D. Tatchell, I. Clark, "System-Level Thermal Modeling of a compact, High Efficiency Cooling Device for the PA8000 Processor", 1999 Proceedings International Systems Packaging Symposium, pp. 41-46.