Electrical applications of carbon materials

Journal of Materials Science

Volumn 39, Issue 8, 2004, Pages 2645-2661

  Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINDERS; CARBON BLACK; CRYSTALLINE MATERIALS; ELECTRIC CONDUCTANCE; ELECTRIC SWITCHES; ELECTRONIC EQUIPMENT; GRAPHITE; GRAPHITIZATION; SHEARING; SIGNAL INTERFERENCE; STRENGTH OF MATERIALS; THERMOELECTRIC ENERGY CONVERSION; THERMOELECTRICITY;

CARBON FILAMENTS; FLEXIBLE GRAPHITE; MESOPHASE PITCH; THERMAL PASTES;

CARBON FIBERS;

EID: 2142709494     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000021439.18202.ea     Document Type: Review

References (220)

1. K. KINOSHITA, "Carbon" (Wiley, NewYork,NY, 1988)p.405.
2. J. LAHAYE, M. J. WETTERWALD and J. MESSIET, J. Appl. Electrochem. 14 (1984) 545.
3. M. DOHZONO, H. KATSUKI and M. EGASHIRA, J. Electrochem. Soc. 137 (1989) 1255.
4. D. KOHLER, J. ZABASAJJA, A. KRISHNAGOPALAN and B. TATARCHUK, ibid. 137 (1990) 136.
5. J. LAHAYE, M. J. WETTERWALD and J. MESSIER, J. Appl. Electrochem. 14 (1984) 117.
6. J. L. WEININGER and C. R. MORELOCK, J. Electrochem. Soc. 122 (1975) 116.
7. D. D. L. CHUNG, in "Applications of Submicron Diameter Carbon Filaments," Nanostructured Carbon for Advanced Applications, edited by G. Benedek et al. (Kluwer, Netherlands, 2001), p. 331.
8. C. A. FRYSZ, X. SHUI and D. D. L. CHUNG, J. Power Sources 58(1) (1996) 41.
9. L. WEIMING and D. D. L. CHUNG, Carbon 40(ER3) (2002) 447.
10. C. A. FRYSZ, X. SHUI and D. D. L. CHUNG, J. Power Sources 58(1) (1996) 55.
11. Idem., Carbon 33(12) (1995) 1681.
12. S. WILKENING, Erdol & Kohle Erdgas Petrochemie 39(12) (1986) 551.
13. R. PANGRAZZI, W. H. HARTT and R. KESSLER, Corrosion 50(3) (1994) 186.
14. J. HOU and D. D. L. CHUNG, Cem. Concr. Res. 27(5) (1997) 649.
15. G. H. ANDERSON, Cathodic Protection of a Bridge Deck with Silicon Iron Anodes and Coke Breeze Overlay, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks. (NACE, Houston, Texas, USA, 1985) p. 82.
16. K. C. CLEAR, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 55.
17. J. J. FONTANA and R. P. WEBSTER, Transp Res. Rec. 1041 (1985) 1.
18. V. DUNLAP, Cathodic Protection System Selection, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 131.
19. R. F. STRATFULL,Eleven Years of Success for Coke Breeze C. P. Pavement, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 66.
20. W. R. SCHUTT, Cathodic Protection Applied to Bridge Decks, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 46.
21. A. A. GADALLAH, A. S. NOURELDIN, F. EZZAT and A. OSMAN, Transp. Res. Rec. 968 (1984) 1.
22. M. M. MATEEV and D. L. TOTEV, Dautschuk & Gummi Kunststoffe 49(6) (1996) 427.
23. S. E. ARTEMENKO, L. P. NIKULINA, T. P. USTINOVA, D. N. AKBAROV, E. P. KRAJNOV and V. I. DUBKOVA, Khimicheskie Volonka (4) (1992) 39.
24. J. E. TRAVIS, Soc. Plastics Eng. 8th Annual Pacific Technical Conf. and Tech. Displays (Society of Plastics Engineers, Brookfield Center, CT, 1985) p. 98.
25. A. I. MEDALIA, Rubber Chem. Tech. 59(3) (1986) 432.
26. Data Sheet, Controlled Resistivity Alumina for Static Charge Dissipation, WESGO Technical Ceramics, Belmont, CA.
27. A. V. ZEMLYANUKHIN, V. D. ALEKSEEV, T. V. TIMOFEEVA and Y. V. NIKIFIROV, Steklo i Keramika (6) (1992) 21.
28. T. M. ZHDANOVA, A. V. ZEMLYANUKHIN and S. N. NEUMEECHEVA, Glass Ceramics 48(3/4) (1991) 168.
29. Idem., Steklo i Keramika (4) 1991 24.
30. P. O' SHEA, Evaluation Eng. 36(2) (1997) 6.
31. S. WEN and D. D. L. CHUNG, J. Electron Mater 30(11) (2001) 1448.
32. P.-W. CHEN and D. D. L. CHUNG, ACI Mater. J. 93(2) (1996) 129.
33. R. BREWER and G. FENICAL, Shielding, Eval. Eng. 37(7) (1998) S4-S10.
34. P. O' SHEA, Evaluation Eng. 37(6) (1998) 40,43,45.
35. S. SHINAGAWA, Y KUMAGAI and K URABE, J. Porous Mater. 6(3) (1999) 185.
36. J. HAJDU, Trans. Inst. Metal. Finishing 75(pt. 1) (1997) B7.
37. N. V. MANDICH, Plat. Surf. Finish. 81(10) (1994) 60.
38. C. NAGASAWA, Y. KUMAGAI, K. URABE and S. SHINAGAWA, J. Porous Mater. 6(3) (1999) 247.
39. S. L. THOMPSON, Evaluation Eng. 37(7) (1998) 62,65.
40. D. A. OLIVERO and D. W. RADFORD, J. Reinf. Plast. Comp. 17(8) (1998) 674.
41. K. P. SAU, T. K. CHAKI, A. CHAKRABORTY and D. KHASTGIR, Plast. Rub. Comp. Proc. Appl. 26(7) (1997) 291.
42. C. Y. HUANG and J. F. PAI, J. Appl. Polym. Sci. 63(1) (1997) 115.
43. M. A. SALTZBERG, A. L. NELLER, C. S. HARVEY, T. E. BORNINSKI and R. J. GORDON, Circuit World22(3) (1996) 67.
44. J. WANG, V. V. VARADAN and V. K. VARADAN, SAMPE J. 32(6) (1996) 18.
45. J. JOO, A. G. MACDIARMID and A. J. EPSTEIN, Proc. 53rd Annual Tech. Conf. 2 (1995) 1672.
46. P. YAM, Sci. Amer. 273(1) (1995) 82.
47. H. H. KUHN, A. D. CHILD and W. C. KIMBRELL, Synthetic Metals 71(1-3) (1995) 2139.
48. M. T. NGUYEN and A. F. DIAZ, Adv. Mater. 6(11) (1994) 858.
49. S. H. PENG and K. ZHANG, Finite Element Analysis Aided Engineering of Elastomeric EMI shielding Gaskets, in Proc. 1998 56th Annual Tech. Conf. (Society of Plastic Engineers, Brookfield, CT, 1998) Vol. 2, p. 1216.
50. S. K. DAS, J. NUEBEL and B. ZAND, Investigation on the Sources of Shielding Degradation for Gaskets with Zinc Coated Steel Enclosures, in Proc. 1997 IEEE 14th International Symposium on Electromagnetic Compatibility (IEEE, Piscataway, NJ, 1997) p. 66.
51. S. H. PENG and W. S. V. TZENG, Recent Developments in Elastomeric EMI Shielding Gasket Design, in Proc. 1997 International Symposium on Electromagnetic Compatibility (IEEE, Piscataway, NJ, 1997) p. 94.
52. P. O' SHEA, Eval. Engng. 36(8) (1997) 6.
53. Idem., ibid. 35(8) (1996) 4.
54. P. B. JANA and A. K. MALLICK, J. Elast. Plast. 26(1) (1996) 58.
55. L. LI and D. D. L. CHUNG, Composites 25(3) (1994) 215.
56. X. SHUI and D. D. L. CHUNG, J. Electron. Mater. 26(8) (1997) 928.
57. X. FU and D. D. L. CHUNG, Cem. Concr. Res. 26(10) (1997) 1467.
58. J.-M. CHIOU, Q. ZHENG and D. D. L. CHUNG, Composites 20(4) (1989) 379.
59. X. FU and D. D. L. CHUNG, Carbon 36(4) (1998) 459.
60. J. CAO and D. D. L. CHUNG, ibid. 41(12) (2003) 2433.
61. S. WEN and D. D. L. CHUNG, Cem. Concr. Res. in press.
62. www.achesonindustries.com
63. J. WU and D. D. L. CHUNG, Carbon 41(6) (2003) 1313.
64. J. CAO and D. D. L. CHUNG, Cem. Concr. Res. 33(11) (2003) 1737.
65. B. R. CHADHA, D. P. DOBHAL and L. R. GUPTA, Industr. Lubric. Tribol. 41(3) (1989) 4.
66. M. TSUKUDA, K. TAKADA and K. OZAKI, J. Jpn. Inst. Light Metals 29(9) (1979) 403.
67. B. LEE, Silicone Rubber. Enging. 236(10) (1995) 32.
68. J. C. ROBERTS and P. D. WEINHOLD, J. Comp. Mater. 29(14) (1995) 1834.
69. M. CHOATE and G. BROADBENT, Toughened Phenolic SMC for EMI Shielding Applications, in Proc. 1996 Regional Tech. Conf. of the Society of Plastic Engineers (Society of Plastices Engineers, Brookfield, CT, 1996) p. 69.
70. P. D. WIENHOLD, D. S. MEHOKE, J. C. ROBERTS, G. R. SEYLAR and D. L. KIRKBRIDE, Electromagnetic Interference (EMI) Shielding Effectiveness, Surface Resistivity, and RF Conductivity of Thin Composites for Spacecraft Applications, in Proc. 1998 30th International SAMPE Tech. Conf. (SAMPE, Covina, CA, 1998) Vol. 30, p. 243.
71. A. FERNYHOUGH and Y. YOKOTA, Comp. IT. Mater. World 5(4) (1997) 202.
72. T. HIRAMOTO, T. TERAUCHI and J. TOMIBE, Controlling ESD and Absorbing and Shielding EMW by Using Conductive Fiber in Aircraft, in Proc. 1998 20th Annual International EOS/ESD Symp. (Electrostatic Discharge Association, Rome, NY, 1998) p. 18.
73. L. G. MORIN, JR and R. E. DUVALL, Applications for Copper and Nickel-Copper-Nickel Electroplated Carbon Fibers for EMI/RFI Shielding, in Proc. 1998 43rd International SAMPE Symp. and Exhib. (SAMPE, Covina, CA, 1998) Vol. 43, No. 1, p. 874.
74. J. R. GAIER, M. L. DAVIDSON and R. K. SHIVELY, Durability of Intercalated Graphite Epoxy Composites in Low Earth Orbit, in Proc. 1996 28th International SAMPE Tech. Conf. (SAMPE, Covina, CA, 1996) Vol. 28, p. 1136.
75. J. M. LIU, S. N. VERNON, A. D. HELLMAN and T. A. CAMPBELL, Electromagnetic Nondestructive Evaluation of Composites for Navy Ship Applications, in Proc. SPIE - The International Society for Optical Engineering (Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, 1995) Vol. 2459, p. 60.
76. D. A. OLIVERO and D. W. RADFORD, Integrating EMI Shielding into Composite Structure, in Proc. 1996 28th International SAMPE Tech. Conf. (SAMPE, Covina, CA, 1996) Vol. 28, p. 1110.
77. T. OKABE, K. SAITO, H. TOGAWA and Y. KUMAGAI, Zairyo/J. Soc. Mater. Sci., Japan 44(498) (1995) 288.
78. L. G. MORIN, JR and R. E. DUVALL, in Proc. 1998 43rd International SAMPE Symp. and Exhib. (SAMPE, Covina, CA, 1998) Vol. 43, No. 1, p. 874.
79. J. R. GAIER and J. TERRY, in Proc. 1994 7th International SAMPE Electronics Conf. (SAMPE, Covina, CA, 1994) Vol. 7, p. 221.
80. J. R. GAIER, M. L. DAVIDSON and R. K. SHIVELY, in Proc. 1996 28th International SAMPE Tech. Conf. on Technology Transfer in a Global Community (SAMPE, Covina, CA, 1996) Vol. 28, p. 1136.
81. J. M. LIU, S. N. VERNON, A. D. HELLMAN and T. A. CAMPBELL, in Proc. of SPIE - The International Soc. for Optical Eng. (Society of Photo-Optical Instrumentation Engineering, Bellingham, WA, 1995) Vol. 2459, p. 60.
82. D. A. OLIVERO and D. W. RADFORD, in Proc. 1996 28th International SAMPE Tech. Conf. on Technology Transfer in a Global Community (SAMPE, Covina, CA, 1996) Vol. 28, p. 1110.
83. J. WU and D. D. L. CHUNG, Carbon 40(ER3) (2002) 445.
84. X. LUO and D. D. L. CHUNG, ibid. 34(10) (1996) 1293.
85. A. PERKINS and A. GUTHRIE, Metallurgia 19(12) (1982) 605.
86. K. EBELING, Betonwerk und Fertigteil - Technik 60(12)(1994) 70.
87. F. LAZZARI and G. RAFFELLINI, Intern. J. Amb. Energy 2(3) (1981) 141.
88. A. KUMAR, U. SINGH, A. SRIVASTAVA and G. N. TIWARI, Appl. Energy 8(4) (1981) 255.
89. S. P. SETH, M. S. SODHA and A. K. SETH, ibid. 10(2) (1982) 141.
90. N. D. KAUSHIK and S. K. RAO, ibid. 12(1) (1982) 21.
91. A. H. FANNEY, B. P. DOUGHERTY and K. P. DRAMP, Field Performance of Photovoltaic Solar Water Heating Systems, in Proc. 1997 International Solar Energy Conf. (ASME, New York, NY, 1997) p. 171.
92. K. PELISSIER, T. CHARTIER and J. M. LAURENT, Ceram. Intern. 24(5) (1998) 371.
93. F. S. G. DOS SANTOS and J. W. SWART,J. Electrochem. Soc. 137(4) (1990) 1252.
94. M. J. CATTELINO, G. V. MIRAN and B. SMITH, IEEE Trans. Electr. Dev. 38(10) (1991) 2239.
95. C. C. HUNG, M. E. DILLEHAY and M. STAHL, J. Aircraft 24(10) (1987) 725.
96. J. XIE, J. WANG, X. WANG and H. WANG, Hecheng Shuzhi Ji Suliao/Synthetic Resin & Plastics 13(1) (1996) 50.
97. C. SANDBERG, W. WHITNEY, A. NASSAR and G. KUSE, Intellignet Distributed Heater used for Industrial Applications, in Proc. 1995 IEEE International Conf. Systems, Man and Cybernetics (IEEE, Piscataway, NJ 1995) Vol. 4, p. 3346.
98. V. N. PROKUSHIN, A. A. SHUBIN, V. V. KLEJMENOV and E. N. MARMER, Khimicheskie Volkna (6) (1992) 50.
99. H. W. LONG and G. E. LONG, Asphaltic Compositions and Uses Therefor, U.S. Patent no. 6,193,793 (2001).
100. I. V. AVTONOMOV and G. A. PUGACHEV, Resistive Composite Material Based on an Alkaline Slag Binder, Izvestiya Sibirskogo Otdeleniya Akademii Nauk Sssr, Seriya Tekhnicheskikh Nauk (1987) Vol. 21, p. 110.
101. S. YEHIA, C.Y. TUAN, D. FERDON and B. CHEN, ACI Mater. J. 97(2) (2000) 172.
102. Y. KASAI, Concr. Int: Design. Constr. 11(3) (1989) 33.
103. W. NAKAGAWA, K. NISHITA and Y. KASAI, Stripping Demolition of Reinforced Concrete by Electric Heating Method, in Proc. 2nd ASME-JSME Nuclear Engineering Joint Conf. (ASME, New York, NY, 1993) p. 871.
104. F. S. CHUTE, F. E. VERMEULEN and M. R. CERVENAN, Canadian Electr. Eng. J. 6(1) (1981) 20.
105. M. J. CATTELINO, G. V. MIRAN and B. SMITH, IEEE Trans. Electr. Dev. 38(10) (1991) 2239.
106. C.-C. HUNG, M. E. DILLEHAY and M. STAHL J.Aircraft 24(10) (1987) 725.
107. J. XIE, J. WANG, X. WANG and HAO WANG, Hecheng Shuzhi Ji Suliao (Synthetic Resin & Plastics) 13(1) (1996) 50.
108. P. L. ZALESKI, D. J. DERWIN and W. H. FLOOD, JR. Electrically Conductive Paving Mixture and Pavement System, U.S. Patent no. 5,707,171, (1998).
109. P. XIE, P. GU, Y. FU and J. J. BEAUDOIN, Conductive Cement-Based Compositions, U.S. Patent 5,447,564 (1995).
110. P. XIE and J. J. BEAUDOIN, Electrically Conductive Concrete and Its Application in Deicing, ACI SP 154-21, Advances in Concrete Technology, edited by V. M. Malhotra (1995) p. 399.
111. V. N. PROKUSHIN, A. A. SHUBIN, V. V. KLEJMENOV and EH. N. MARMER, Khimicheskie Volkna (6) (1992) 50.
112. B. SONG and R. VISKANTA, J. Therm. Heat Trans. 4(3) (1990) 311.
113. M. HIGAKI, M. NARITA and M. NAKAYAMA, NEC Research Development (89) (1988) 81.
114. U.S. Patent No. 5,912,080.
115. U.S. Patent No. 6,083,625.
116. R. CHUGH and D. D. L. CHUNG, Carbon 40(13) (2002) 2285.
117. T. KIM and D. D. L. CHUNG, ibid. 41(12) (2003) 2436.
118. J. TSUKAMOTO, A. TAKAHASHI, J. TANI and T. ISHIGURO, ibid. 27(6) (1989) 919.
119. C.T. HO and D. D. L. CHUNG, ibid. 28(6) (1990) 825.
120. V. GUPTA, R. B. MATHUR, O. P. BAHL, A. MARCHAND and S. FLANDROIS, ibid. 33(11) (1995) 1633.
121. D. E. WESSBERCHER, W. C. FORSMAN and J. R. GAIER, Synth Met. 26(2) (1988) 185.
122. C. HÉROLD, A. HÉROLD and P. LAGRANGE, J. Phys. Chem. Solids 57(6-8) (1996) 655.
123. S. WANG and D. D. L. CHUNG, Comp. Interf. 6(6) (1999) 519.
124. Idem., ibid. 6(6) (1999) 497.
125. S. WEN and D. D. L. CHUNG, Cem. Concr. Res. 29(12) (1999) 1989.
126. M. SUN, Z. LI, Q. MAO and D. SHEN, ibid. 28(4) (1998) 549.
127. Idem., ibid. 28(12) (1998) 1707.
128. Idem., ibid. 29(5) (1999) 769.
129. S. WEN and D. D. L. CHUNG, ibid. 30(4) (2000) 661.
130. P.-W. CHEN and D. D. L. CHUNG, Composites: Part B27B (1996) 269.
131. Idem., ACI Mater. J. 93(2) (1996) 129.
132. A. M. BRANDT and L. KUCHARSKA, Materials for the New Millennium, in Proc. Mater. Eng. Conf. (ASCE, New York, NY, 1996) Vol. 1, p. 271.
133. N. BANTHIA and J. SHENG, Cem. Concr. Compos 18(4) (1996) 251.
134. B. MOBASHER and C. Y. LI,ACI Mater. J. 93(3) (1996) 284.
135. M. PIGEON, M. AZZABI and R. PLEAU, Cem. Concr. Res. 26(8) (1996) 1163.
136. N. BANTHIA, C. YAN and K. SAKAI, Cem. Concr.Compos. 20(5) (1998) 393.
137. T. URANO, K. MURAKAMI, Y. MITSUI and H. SAKAI, Composites - Part A: Appl. Sci. Manufact. 27(3) (1996) 183.
138. S. WEN and D. D. L. CHUNG, J. Mater. Res. 16(7) (2001) 1989.
139. R. A. HORNE, J. Appl. Phys. 30 (1959) 393.
140. V. H. GUERRERO, S. WANG and S. WEN, J. Mater. Sci. 37(19) (2002) 4127.
141. D. J. BERGMAN and L. G. FEL, J. Appl. Phys. 85 (1999) 8205.
142. M. KAMBE, Mater. Sci. Forum 308-311 (1999) 653.
143. M. ARAI, M. KAMBE, T. OGATA and Y. TAKAHASHI, Nippon Kikai Gakkai Ronbunshu, a Hen 62(594) (1996) 1996.
144. C. UHER, Phys. Rev. B 25(6) (1982) 4167.
145. Y. M. HOI and D. D. L. CHUNG, Carbon 40(7) (2002) 1134.
146. Y. HISHIYAMA and A. ONO, ibid. 23(4) (1985) 445.
147. Y. KABURAGI and Y. HISHIYAMA, ibid. 36(11) (1998) 1671.
148. A. ONO and Y. HISHIYAMA, Philos. Mag. B - Phys. Cond. Matter. Struct. Electr. Opt. Magn. Prop. 59(2) (1989) 271.
149. J. P. HEREMANS, Extended Abstracts and Program - 17th Biennial Conference on Carbon (American Carbon Society, University Park, PA, 1985) p. 231.
150. J. TSUKAMOTO, A. TAKAHASHI, T. TANI and T. ISHIGURO, Carbon 27(6) (1989) 919.
151. X. WANG and D. D. L. CHUNG, ibid. 35(5) (1997) 706.
152. S. WANG and D. D. L CHUNG, ibid. 35(5) (1997) 621.
153. B. T. KELLY, "Physics of Graphite" (Applied Science Publishers, London, 1981).
154. X. FU, W. LU and D. D. L. CHUNG, Cem. Concr. Res. 26(7) (1996) 1007.
155. X. FU, E. MA and D. D. L. CHUNG, ibid. 27(6) (1997) 845.
156. X. FU, W, LU and D. D. L. CHUNG, ibid. 28(2) (1998) 183.
157. P. CHEN and D. D. L. CHUNG, Smart Mater. Struct. 2 (1993) 22.
158. Idem., J. Amer. Ceram. Soc. 78(3) (1995) 816.
159. D. D. L. CHUNG, J. Electroceram. 6(1) (2001) 75.
160. P. CHEN and D. D. L. CHUNG, ACI Mater. J. 93(4) (1996) 341.
161. D. D. L. CHUNG, Smart Mater. Struct. 4 (1995) 59.
162. X. FU and D. D. L. CHUNG, Cem. Concr. Res. 26(1) (1996) 15.
163. Idem., ibid. 27(9) (1997) 1313.
164. Z. SHI and D. D. L. CHUNG, ibid. 29(3) (1999) 435.
165. S. WEN and D. D. L. CHUNG, ibid. 30(8) (2000) 1289.
166. Idem., ibid. 31(2) (2001) 297.
167. Idem., ibid. 31(4) (2001) 665.
168. Q. MAO, B. ZHAO, D. SHEN, Z. LI, J. WUHAN and U. TECH, Mater. Sci. Ed. 11(3) (1996) 41.
169. Q. MAO, B. ZHAO, D. SHEN and Z. LI, Fuhe Cailiao Xuebao/Acta Materiae Composite Sinica 13(4) (1996) 8.
170. B. ZHAO, Z. LI, D. WU, J. WUHAN and U. TECH, Mater. Sci. Ed. 10(4) (1995) 52.
171. D. D. L. CHUNG, J. Mater. Sci. 36 (2001) 1315.
172. S. WEN and D. D. L. CHUNG, Cem. Concr. Res. 31(2) (2001) 291.
173. M. SUN, Q. LIU, Z. LI and Y. HU, ibid. 30(10) (2000) 1593.
174. D.-M. BONTEA, D. D. L. CHUNG and G. C. LEE, ibid. 30(4) (2000) 651.
175. J. LEE and G. BATSON, Materials for the New Millenium, in Proc. 4th Mater. Eng. Conf. (1996) Vol. 2, p. 887.
176. J. CAO and D. D. L. CHUNG, Cem. Concr. Res. 31(4) (2001) 669.
177. Idem., J. Mater. Sci. 36(18) (2001) 4345.
178. S. WEN and D. D. L. CHUNG, Cem. Concr. Res. 29(6) (1999) 961.
179. W. J. MCCARTER, J. Amer. Ceram. Soc. 78(2) (1995) 411.
180. S. WANG and D. D. L. CHUNG, Polym. Comp. 22(1) (2001) 42.
181. N. MUTO, H. YANAGIDA, T. NAKATSUJI, M. SUGITA, Y. OHTSUKA and Y. ARAI, Smart Mater. Struct. 1 (1992) 324.
182. X. WANG, X. FU and D. D. L. CHUNG, J. Mater. Res. 14(3) (1999) 790.
183. X. WANG and D. D. L. CHUNG, Composites:Part B 29B(1) (1998) 63.
184. P. E. IRVING and C. THIOGARAJAN, Smart Mater. Struct. 7 (1998) 456.
185. X. WANG and D. D. L. CHUNG, Polym. Compos. 18(6) (1997) 692.
186. X. WANG, S. WANG and D. D. L. CHUNG, J. Mater. Sci. 34(11) (1999) 2703.
187. S. WANG and D. D. L. CHUNG, Polym. Compos. 9(2) (2001) 135.
188. N. MUTO, H. YANAGIDA, M. MIYAYAMA, T. NAKATSUJI, M. SUGITA and Y. OHTSUKA, J. Ceram. Soc. Jpn. 100(4) (1992) 585.
189. N. MUTO, H. YANAGIDA, T. NAKATSUJI, M. SUGITA, Y. OHTSUKA, Y. ARAI and C. SAITO, Adv. Compos. Mater. 4(4) (1995) 297.
190. R. PRABHAKARAN, Experim. Techn. 14(1) (1990) 16.
191. M. SUGITA, H. YANAGIDA and N. MUTO, Smart Mater. Struct. 4(1A) (1995) A52.
192. A. S. KADDOUR, F. A. R. AL-SALEHI, S. T. S. ALHASSANI and M. J. HINTON, Comp. Sci. Tech. 51 (1994) 377.
193. O. CEYSSON, M. SALVIA and L. VINCENT, Scripta Materialia 34(8) (1996) 1273.
194. K. SCHULTE and C. BARON, Comp. Sci. Tech. 36 (1989) 63.
195. K. SCHULTE and J. PHYSIQUE IV, Colloque C7 3 (1993) 1629.
196. J. C. ABRY, S. BOCHARD, A. CHATEAUMINOIS, M. SALVIA and G. GIRAUD, Comp. Sci. Tech. 59(6) (1999) 925.
197. A. TEDOROKI, H. KOBAYASHI and K. MATUURA, JSME Int. J. Series A - Solid Mech. Streng. Mater. 38(4) (1995) 524.
198. S. HAYES, D. BROOKS, T. LIU, S. VICKERS and G. F. FERNANDO, in Proc. SPIE - The Int. Soc. for Optical Engng. 2718 (1996) 376.
199. S. WANG, Z. MEI and D. D. L. CHUNG, Int. J. Adh. Adh. 21(ER6) (2001) 465.
200. S. WANG and D. D. L. CHUNG, Polym. Polym. Comp. 9(2) (2001) 135.
201. S. WANG, Z. MEI and D. D. L. CHUNG, Int. J. Adh. Adh. 21(ER6) (2001) 465.
202. S. WANG and D. D. L. CHUNG, Comp. Interf. 6(6) (1999) 497.
203. Idem., Composites: Part B 30(6) (1999) 591.
204. Idem., Carbon 35(5) (1997) 621.
205. P. J. MATHER and K. M. THOMAS, J. Mater. Sci. 32(7) (1997) 1711.
206. H. TANG, X. CHEN and Y. LUO, Eur. Polym. J. 32(8) (1996) 963.
207. C.-M. CHAN, C.-L. CHENG and M. M. F. YUEN, Polym. Eng. Sci. 37(7) (1997) 1127.
208. M. OMASTOVÁ, J. PROKEŠ, S. PODHRADSKÁ and I. CHODÁK, Macromol. Symp. 170 (2001) 231.
209. N. A. KOVALENKO and I. K. SYROVATSKAYA, Int. Polym. Sci. Tech. 28(6) (2001) T/57.
210. Y. CHEKANOV, R. OHNOGI, S. ASAI and M. SUMITA, J. Mater. Sci. 34(22) (1999) 5589.
211. Z. YAO, H. W. C. POSTMA, L. BALENTS and C. DEKKER, Nature 402 (1999) 273.
212. E. G. WOLFF and D. A. SCHNEIDER, Int. J. Heat Mass Transfer 41(22) (1998) 3469.
213. T. OUELLETTE and M. DE SORGO, Thermal Performance of Heat Transfer Interface Materials, in Proc. Power Electronics Design Cont., Power Sources Users Conf. (Cerritos, CA, 1985) p. 134.
214. M. R. VOGEL, Thermal Performance for a Miniature Heat Sink Cooled by MicroPCM Slurry, in Proc. Int. Intersociety Electronic Packaging Conf., Adv. In Electronic Packaging (American Society of Mechanical Engineers, New York, NY, 1995) Vol. 10-12, p. 989.
215. S. W. WILSON, A. W. NORRIS, E. B. SCOTT and M. R. COSTELLO, Thermally Conductive Adhesives for Highly Thermally Stressed Assembly, National Electronic Packaging and Production Conf., Proc. Technical Program (Reed Exhibition Companies, Norwalk, CT, 1996) Vol. 2, p. 788.
216. A. L. PETERSON, Silicones with Improved Thermal Conductivity for Thermal Management in Electronic Packaging, in Proc. 40th Electronic Components and Tech. Conf. (IEEE, Piscataway, NJ, 1990) Vol. 1, p. 613.
217. X. LU, G. XU, P. G. HOFSTRA and R. C. BAJCAR, J. Polym. Sci., Part B 36(13) (1998) 2259.
218. T. SASASKI, K. HISANO, T. SAKAMOTO, S. MONMA, Y. FIJMORI, H. IWASAKI and M. ISHIZUKA, Development of sheet type thermal conductive compound using AIN. Japan IEMP Symp. Proc., IEEE/CPMT Int. Electronic Manufacturing Technology (IEMT) Symp. (IEEE, Piscataway, NJ, 1995) p. 236.
219. C.-K. LEONG and D. D. L. CHUNG, Carbon 41(13) (2003) 2459.
220. Y. XU, C. K. LEONG and D. D. L. CHUNG, unpublished results.