Effect of substrate surface texture and flux coating on the evolution of microstructure during solidification of lead free Sn-3.5Ag solder alloy

Materials and Design

Volumn 25, Issue 5, 2004, Pages 447-449

  Prabhu, K Narayan ^a   Bali, Rantej ^a   Ranjan, Rajat ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

Microstructure; Solder; Solidification; Substrate; Surface texture

Indexed keywords

COATINGS; EUTECTICS; INTERFACES (MATERIALS); MICROSTRUCTURE; SILVER ALLOYS; SOLIDIFICATION; SURFACE ROUGHNESS; SURFACE TENSION; TEXTURES; WETTING;

FLUX COATINGS; SURFACE TEXTURES;

SOLDERING ALLOYS;

SURFACE TREATMENT;

EID: 1942498775     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2003.11.008     Document Type: Article

References (5)

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