Heat transfer at the metal/substrate interface during solidification of Pb-Sn solder alloys

Journal of Materials Engineering and Performance

Volumn 11, Issue 3, 2002, Pages 265-273

  Prabhu, K Narayan ^a   Kumar, S T ^a   Venkataraman, N ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

Pb Sn solder alloys; Solder substrate; Solidification

Indexed keywords

COATINGS; COPPER; HEAT FLUX; HEAT TRANSFER; INTERFACES (MATERIALS); LEAD ALLOYS; METAL CASTING; MICROSTRUCTURE; SOLIDIFICATION; STEEL; TEMPERATURE;

FLUX COATING; HEAT FLOW; HEAT TRANSFER ANALYSIS; ONE-DIMENSIONAL HEAT CONDUCTION EQUATION;

SOLDERING ALLOYS;

EID: 0036612122     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994902770344051     Document Type: Article

References (14)

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