Microstructure and physical properties of arc ion plated TiAlN/Cu thin film

Surface and Coatings Technology

Volumn 201, Issue 7 SPEC. ISS., 2006, Pages 3982-3986

  Leu, Ming Sheng ^a   Lo, Shen Chuan ^a   Wu, Jin Bao ^a   Li, Ai Kang ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Aluminum nitride; Cathadic Vacumm arc; Copper; Multilayer; Nano indention; Titanium

Indexed keywords

ELASTIC MODULI; ENERGY DISPERSIVE SPECTROSCOPY; HIGH RESOLUTION ELECTRON MICROSCOPY; METALLOGRAPHIC MICROSTRUCTURE; MULTILAYERS; OXIDATION RESISTANCE; PHYSICAL PROPERTIES; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

CATHODIC VACUUM ARC (CVA); MULTILAYERD COATED MATERIAL; NANO-LAMINATES; NANOMULTILAYER STRUCTURE;

TITANIUM ALLOYS;

ELASTIC MODULI; ENERGY DISPERSIVE SPECTROSCOPY; HIGH RESOLUTION ELECTRON MICROSCOPY; METALLOGRAPHIC MICROSTRUCTURE; MULTILAYERS; OXIDATION RESISTANCE; PHYSICAL PROPERTIES; THIN FILMS; TITANIUM ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 33751278511     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.08.001     Document Type: Article

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