A global view of interconnects

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2200-2207

  List, Scott ^a   Bamal, Mandeep ^b,c   Stucchi, Michele ^c   Maex, Karen ^b,c  

^a Intel Corporation Belgium   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c IMEC   (Belgium)

Author keywords

3D; Benchmarking; CNTs; Interconnects; LC; Optical

Indexed keywords

BANDWIDTH; BENCHMARKING; BOUNDARY CONDITIONS; ELECTRIC LINES; OPTICAL PROPERTIES; SEMICONDUCTOR MATERIALS; THREE DIMENSIONAL;

CNTS; INTERCONNECTS; LC;

INTERCONNECTION NETWORKS;

EID: 33751258626     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.10.003     Document Type: Article

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