X-ray microscopy studies of electromigration in advanced copper interconnects

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 217-222

  Schneider, G ^a   Guttmann, P ^b   Rudolph, S ^a   Heim, S ^a   Rehbein, S ^a   Meyer, M A ^c   Zschech, E ^c  

^a HAHN MEITNER INSTITUT   (Germany)

^b UNIVERSITY OF GÖTTINGEN   (Germany)

^c IBM MICROELECTRONICS   (United States)

Author keywords

Copper interconnects; Electromigration; X ray microscopy

Indexed keywords

EID: 33751225675     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173553     Document Type: Conference Paper

References (9)

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4. P. Guttmann et al., Journal de Physique IV 104, 85 (2003).
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8. G. Schneider, G. Denbeaux, E.H. Anderson, B. Bates, A. Pearson, M.A. Meyer, E. Zschech, E.A. Stach, Appl. Phys. Lett. 81, 2535 (2002).
9. E. Zschech, M. A. Meyer, E. Langer, Proc. MRS Spring, 812, F7.5.1. (2004)