Embedding effects of the high-pressure annealing process via minute holes and trenches in dual damascene copper interconnections

R and D: Research and Development Kobe Steel Engineering Reports

Volumn 54, Issue 1, 2004, Pages 44-51

  Onishi, Takashi ^a   Yoshikawa, Tetsuya ^a   Munemasa, Jun ^a   Fujii, Hideo ^a   Inoue, Takao ^a   Miyagaki, Aki ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FINITE ELEMENT METHOD; HIGH PRESSURE EFFECTS; STRAIN; THERMOELASTICITY; THIN FILMS;

COPPER INTERCONNECTIONS; HIGH-PRESSURE ANNEALING; SIPHONING PHENOMENON;

ANNEALING;

EID: 33751180549     PISSN: 03738868     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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