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Volumn 43, Issue 7, 2002, Pages 1605-1614
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Application of high-pressure annealing process to dual damascene copper interconnections
a
a
KOBE STEEL LTD
(Japan)
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Author keywords
Copper interconnection; Dual damascene fabrication process; Electro back scatter diffraction pattern; Electroplating metallization; High pressure annealing; Large scale integration; Sputtering deposition
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Indexed keywords
ADHESION;
ANNEALING;
ARGON;
COPPER;
CRYSTAL ORIENTATION;
ELECTROPLATING;
HIGH PRESSURE EFFECTS;
LSI CIRCUITS;
OPTIMIZATION;
RELIABILITY;
HIGH-PRESSURE ANNEALING;
ELECTRIC CONNECTORS;
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EID: 0036630271
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.43.1605 Document Type: Article |
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Times cited : (13)
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References (14)
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