|
Volumn 5288, Issue , 2003, Pages 881-886
|
Packaging Challenges of High-Power LEDs for Solid State Lighting
|
Author keywords
Flipchip packaging; LED; Optoelectronics packaging; Solid state lighting; Thermal management
|
Indexed keywords
FLIPCHIP PACKAGING;
OPTOELECTRONICS PACKAGING;
SOLID STATE LIGHTING;
THERMAL MANAGEMENT;
DIES;
HEAT FLUX;
HEAT RESISTANCE;
LIGHT EMITTING DIODES;
MICROPROCESSOR CHIPS;
MONOCHROMATORS;
NATURAL CONVECTION;
PHOSPHORS;
RELIABILITY;
SEMICONDUCTOR JUNCTIONS;
ELECTRONICS PACKAGING;
|
EID: 2342514224
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (13)
|
References (9)
|