Impact of pore size and morphology of porous organosilicate glasses on integrated circuit manufacturing

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 1-14

  O'Neill, Mark L ^a   Haas, Mary K ^a   Peterson, Brian K ^a   Vrtis, Raymond N ^a   Weigel, Scott J ^a   Wu, Dingjun ^a   Bitner, Mark D ^a   Karwacki, Eugene J ^a  

^a AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MECHANICAL PROPERTIES; MORPHOLOGY; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PORE SIZE; POROSITY;

DIELECTRIC INSULATORS; PLASMA REACTIVITY; POROUS ORGANOSILICATE MATERIALS; ULTRAVIOLET POST TREATMENTS;

BOROSILICATE GLASS;

EID: 33749607786     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f01-02     Document Type: Conference Paper

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