Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects

Journal of Electronic Materials

Volumn 35, Issue 9, 2006, Pages 1693-1700

  Chuang, Cheng Li ^a   Aoh, Jong Ning ^b  

^a CHUNG SHAN MEDICAL UNIVERSITY   (Taiwan)

^b NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Chips with copper interconnects; High temperature storage (HTS) test; Silver bonding layer; Thermosonic wire bonding

Indexed keywords

BONDING; COPPER OXIDES; DEPOSITION; GOLD; MICROPROCESSOR CHIPS; WIRE; X RAY ANALYSIS;

COPPER INTERCONNECTS; COPPER PADS; SILVER BONDING LAYERS; THERMOSONIC BONDING;

INTEGRATED CIRCUIT LAYOUT;

EID: 33749338418     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0220-z     Document Type: Article

References (13)

1. J. Ida, M. Yoshimaru, T. Usami, A. Ohtomo, K. Shimokawa, A. Kita, and M. Ino, Proc. VLSI Technology Symp. (1994), pp. 59-60.
2. M. Miyamoto, T. Takeda, and T. Furusawa, IEEE Trans. Electron Dev. 44, 250 (1997).
3. G. Deltoro and N. Sharif, 24th IEEE/CPMT (Piscataway, NJ: IEEE, 1999), pp. 185-188.
4. C.L. Chuang, J.N. Aoh, and R.F. Din, Microelectron. Reliab. 46, 449 (2006).
5. J.N. Aoh and C.L. Chuang, J. Electron. Mater. 33, 310 (2004).
6. T.A. Tran and L. Yong, S. Chen, and A. Chen, IEEE Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2000), pp. 1674-1680.
7. J.F. Rohan, G. O'Riordan, and J. Boardman, Appl. Surf. Sci. 185, 289 (2002).
8. H.S. Chang, J.X. Pon, K.C. Heien, and C.C. Chen, J. Electron. Mater. 30, 1171 (2001).
9. J.N. Aoh and C.L. Chuang, J. Electron. Mater. 33, 299 (2004).
10. J. Aday, R.W. Johnson, J.L. Evans, and C. Romaczuk, Int. J. Microcirc. Electron. Packaging 17, 302 (1994).
11. T.Y. Lin, K.L. Davison, W.S. Leong, S. Chua, Y.F. Yao, J.S. Pan, J.W. Chai, K.C. Toh, and W.C. Tjiu, Microelectron. Reliab. 43, 803 (2003).
12. Wire Bond Shear Test, EIA/JESD22-B116 (Arlington, VA: Electronic Industrial Alliance, 1998).
13. MIL-STD-8836, "Test Method Standard Microcircuits," Method No. 2011.7, Bonding Strength (Destructive Bond Pull Test), Department of Defense, USA, February 2006.