Compact thermal models for estimation of temperature-dependent power/performance in FinFET technology

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn 2006, Issue , 2006, Pages 237-242

  Bansal, Aditya ^a   Meterelliyoz, Mesut ^a   Singh, Siddharth ^c   Choi, Jung Hwan ^a   Murthy, Jayathi ^b   Roy, Kaushik ^a  

^a PURDUE UNIVERSITY   (United States)

^b Purdue University   (United States)

^c OSMANIA UNIVERSITY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HEAT SINKS; HEAT TRANSFER; HIGH TEMPERATURE EFFECTS; INTEGRATED CIRCUIT LAYOUT; LOGIC CIRCUITS; MATHEMATICAL MODELS; RELIABILITY; THERMAL CONDUCTIVITY;

DESIGN CYCLES; FINFET TECHNOLOGIES; POWER DENSITY; TEMPERATURE GRADIENT;

FIELD EFFECT SEMICONDUCTOR DEVICES;

EID: 33748626872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1118299.1118362     Document Type: Conference Paper

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