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Volumn 2001-January, Issue , 2001, Pages 482-487

Chip-level substrate noise analysis with network reduction by fundamental matrix computation

Author keywords

[No Author keywords available]

Indexed keywords

MATRIX ALGEBRA;

EID: 33748619403     PISSN: 19483287     EISSN: 19483295     Source Type: Journal    
DOI: 10.1109/ISQED.2001.915275     Document Type: Article
Times cited : (16)

References (9)
  • 3
    • 0029538064 scopus 로고
    • Integrated circuit substrate coupling models based on voronoi tessellation
    • Dec
    • I. L. Wemple and A. T. Yang, "Integrated circuit substrate coupling models based on voronoi tessellation," IEEE Trans, on CAD, pp. 1459-1469, Dec. 1995.
    • (1995) IEEE Trans, on CAD , pp. 1459-1469
    • Wemple, I.L.1    Yang, A.T.2
  • 4
    • 0030110592 scopus 로고    scopus 로고
    • Modeling and analysis of substrate coupling in integrated circuits
    • Mar
    • R. Gharpurey and R. G. Meyer, "Modeling and analysis of substrate coupling in integrated circuits," IEEE Journal of Solid-State Circuits, 31(3): 344-353, Mar. 1996.
    • (1996) IEEE Journal of Solid-State Circuits , vol.31 , Issue.3 , pp. 344-353
    • Gharpurey, R.1    Meyer, R.G.2
  • 5
    • 0030110603 scopus 로고    scopus 로고
    • Verification techniques of substrate coupling and their application to mixed-signal IC design
    • Mar
    • N. K. Verghese, D. J. Allstot, and M. A. Wolfe, "Verification techniques of substrate coupling and their application to mixed-signal IC design," IEEE Journal of Solid-State Circuits, 31(3): 354-365, Mar. 1996.
    • (1996) IEEE Journal of Solid-State Circuits , vol.31 , Issue.3 , pp. 354-365
    • Verghese, N.K.1    Allstot, D.J.2    Wolfe, M.A.3
  • 7
    • 0021405731 scopus 로고
    • Chip substrate resistance modeling technique for integrated circuit design
    • Apr
    • T. A. Johnson, R. W. Knepper, V. Marcello, and W. Wang, "Chip substrate resistance modeling technique for integrated circuit design," IEEE Trans, on CAD, CAD-3(2): 126-134, Apr. 1984.
    • (1984) IEEE Trans, on CAD , vol.CAD-3 , Issue.2 , pp. 126-134
    • Johnson, T.A.1    Knepper, R.W.2    Marcello, V.3    Wang, W.4
  • 8
    • 0033707515 scopus 로고    scopus 로고
    • Measurements and analysis of substrate noise waveform in mixed signal IC environment
    • June
    • M. Nagata, J. Nagai, T. Morie, and A. Iwata, "Measurements and analysis of substrate noise waveform in mixed signal IC environment," IEEE Trans, on CAD, 19(6): 671-678, June 2000.
    • (2000) IEEE Trans, on CAD , vol.19 , Issue.6 , pp. 671-678
    • Nagata, M.1    Nagai, J.2    Morie, T.3    Iwata, A.4
  • 9
    • 0033697635 scopus 로고    scopus 로고
    • Quantitative characterization of substrate noise for physical design guides in digital circuits
    • May
    • M. Nagata, J. Nagai, T. Morie, and A. Iwata, "Quantitative characterization of substrate noise for physical design guides in digital circuits," in Proc. IEEE Custom Integrated Circuits Conf., pp. 95-98, May 2000.
    • (2000) Proc. IEEE Custom Integrated Circuits Conf. , pp. 95-98
    • Nagata, M.1    Nagai, J.2    Morie, T.3    Iwata, A.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.