Characterization of post-copper CMP surfaces with scanning probe microscopy. Part 1: Surface leakage measurement with conductive atomic force microscopy

Applied Surface Science

Volumn 252, Issue 22, 2006, Pages 7760-7765

  Dominget, A ^a   Farkas, J ^a   Szunerits, S ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b GRENOBLE INSTITUTE OF TECHNOLOGY   (France)

Author keywords

Atomic force microscopy (AFM); Chemical mechanical polishing (CMP); Copper interconnects; Surface leakage

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRIC PROPERTIES; SURFACE CHEMISTRY;

COPPER INTERCONNECTS; ELECTRICAL INTERFACE; SCANNING PROBE MICROSCOPY; SURFACE LEAKAGE;

COPPER;

EID: 33748154158     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.09.018     Document Type: Article

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