Electromigration modeling for integrated circuit interconnect reliability analysis

IEEE Transactions on Device and Materials Reliability

Volumn 1, Issue 1, 2001, Pages 33-42

  Joseph Clement, J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Electromigration; Interconnect reliability; Stress

Indexed keywords

EID: 33747963425     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/7298.946458     Document Type: Article

References (22)

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