A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 27, Issue 4, 2004, Pages 246-253

  Chu, Kun Mo ^a   Lee, Jung Sub ^a   Cho, Han Seo ^a   Park, Hyo Hoon ^a   Jeon, Duk Young ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Flip chip; Fluxless; Indium bump; Silver; Vertical cavity surface emitting laser (VCSEL)

Indexed keywords

BONDING; CHIP SCALE PACKAGES; COATINGS; FLIP CHIP DEVICES; INDIUM; LASER BEAMS; LIGHT PROPAGATION; LOW TEMPERATURE OPERATIONS; MATERIALS TESTING; SILVER; SOLDERING ALLOYS; WAVEGUIDES;

FLUXLESS FLIP CHIP BONDING; POLYMERIC WAVEGUIDE; SILVER COATED INDIUM SOLDER BUMPS; VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL);

SEMICONDUCTOR LASERS;

EID: 14644388165     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2004.843155     Document Type: Article

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