Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 8 B, 2004, Pages 5922-5927

  Chu, Kun Mo ^b   Lee, Jung Sub ^c   Cho, Han Seo ^a   Rho, Byung Sup ^a   Park, Hyo Hoon ^a   Jeon, Duk Young ^c  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Photonics Technology Institute (KOPTI)   (South Korea)

^c Korea Photonics Technology Institute ^*

Author keywords

Flip chip; Indium bump; Optical interconnection; Polymeric waveguide; VCSEL

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; INDIUM; INTEGRATED OPTICS; MICROSTRUCTURE; OPTICAL INTERCONNECTS; POLYMERS;

FLIP CHIP; INDIUM BUMP; POLYMERIC WAVEGUIDE; VERTICAL-CAVITY SURFACE-EMITTING LASER (VCSEL) ARRAYS;

FLIP CHIP DEVICES;

EID: 7544246011     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.5922     Document Type: Conference Paper

References (13)

1. J. A. Neff and Y. C. Lee: Sens. & Actuat. A 91 (2001) 363.
2. T. Hayashi: IEEE Trans. Components, Hybrids & Manuf. Tech. 15 (1992) 225.
3. M. Pez, C. Claudepierre, T. Dean, A. Thurm and S. Paineau: Proc. IPACK'01, Hawaii, 2001.
4. H. Kosaka: IEEE J. Sel. Top. Quantum Electron. 5 (1999) 184.
5. Y. Ohiso, K. Tateno, Y. Kohama, A. Wakatsuki, H. Tsunetsugu and T. Kurokawa: IEEE Photon. Technol. Lett. 8 (1996) 1115.
6. A. V. Krishnamoorthy: IEEE Photon. Technol. Lett. 11 (1999) 128.
7. H. S. Cho, J.-Y. Eo, S. Kang, K.-M. Chu, B. S. Rho and H.-H. Park: Proc. COIN/ACOFT, Australia, 2003, p. 403.
8. K.-M. Chu, J.-S. Lee, B. S. Rho, H. S. Cho, H.-H. Park and D. Y. Jeon: Proc. Microoptics Conf., Japan, 2003, p. 402.
9. H. S. Cho, K.-M. Chu, S. Kang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim and H.-H. Park: to be published in IEEE Adv. Packag. (2004).
10. Y. C. Chen, W. W. So and C. C. Lee: IEEE Trans. Components, Packag & Manuf. Tech. A 20 (1997) 46.
11. M. R. Baren: Binary Alloy Phase Diagrams, ed. T. B. Massalski (Material Park, 1990) p. 47.
12. V. Simic and Z. Marinkovic: Thin Solid Films 61 (1979) 149.
13. R. Roy and S. K. Sen: Thin Solid Films 197 (1992) 303.