Thermal characterization of dielectric and phase change materials for the optical recording applications

Journal of Applied Physics

Volumn 100, Issue 2, 2006, Pages

  Yang, Y ^a   Li, C T ^a   Sadeghipour, S M ^a   Dieker, H ^b   Wuttig, M ^b   Asheghi, M ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LAYERS; PHASE CHANGE MATERIALS; THERMAL BOUNDARY RESISTANCE; THERMAL CHARACTERIZATION;

HEAT RESISTANCE; MATERIALS SCIENCE; MULTILAYERS; OPTIMIZATION; THERMAL CONDUCTIVITY; THERMOANALYSIS;

OPTICAL RECORDING;

EID: 33746794557     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2209723     Document Type: Article

References (35)

1. B.-W. Yang and H.-P. D. Shieh, IEEE J. Sel. Top. Quantum Electron. 4, 821 (1998).
2. T. Ohta, K. Nishiuchi, K. Narumi, Y. Kitaoka, H. Ishibashi, N. Yamada, and T. Kozaki, Jpn. J. Appl. Phys., Part 1 39, 700 (2000).
3. I. Ichimura, K. Kishima, K. Osato, K. Yamamoto, Y. Kuroda, and K. Saito, Jpn. J. Appl. Phys., Part 1 39, 962 (2000).
4. S. Hosaka et al., J. Appl. Phys. 79, 8082 (1996).
5. H. Kado and T. Tohda, Jpn. J. Appl. Phys., Part 1 36, 523 (1997).
6. S. Lai and T. Lowrey, Tech. Dig. - Int. Electron Devices Meet. 2001, 951.
7. C. Peng and M. Mansuripur, Appl. Opt. 39, 2347 (2000).
8. A. C. Sheila and T. E. Schlesinger, J. Appl. Phys. 91, 2803 (2002).
9. Y. C. Hsieh, M. Mansuripur, J. Volkmer, and A. Brewen, Appl. Opt. 36, 866 (1997).
10. E. R. Meinders and H. J. Borg, Technical Digest, ISOM, 2000, p. 216.
11. T. Ohta, N. Akahira, S. Ohara, and I. Satoh, Optoelectron., Devices Technol. 10, 361 (1995).
12. E. M. Wright, P. K. Khulbe, and M. Mansuripur, Appl. Opt. 39, 6695 (2000).
13. J. H. Coombs, A. P. J. M. Jongenelis, W. Van-Es-Spiekman, and B. A. J. Jacobs, J. Appl. Phys. 78, 4906 (1995).
14. Z. L. Mao, H. Chen, and A.-L. Jung, J. Appl. Phys. 78, 2338 (1995).
15. E. Small, J. Reifenberg, Y. Yang, S. M. Sadeghipour, and M. Asheghi, Proceedings of the ASME Summer Heat Transfer Conference, San Francisco, CA, USA, 17-22 July 2005, Paper HT2005-72330.
16. S. Torquato and M. D. Rintoul, Phys. Rev. Lett. 75, 4067 (1995).
17. E. R. Meinders and C. Peng, J. Appl. Phys. 93, 3207 (2003).
18. E. K. Kim, S. I. Kwun, S. M. Lee, H. Seo, and J. G. Yoon, Appl. Phys. Lett. 76, 3864 (2000).
19. E. R. Meinders, J. Mater. Res. 16, 2530 (2001).
20. D. Wamwangi, W. K. Njoroge, and M. Wuttig, Thin Solid Films 408, 310 (2002).
21. K. E. Goodson, O. W. Käding, M. Rösner, and R. Zachai, Appl. Phys. Lett. 66, 3134 (1995).
22. M. N. Touzelbaev, P. Zhou, R. Venkatasubramanian, and K. E. Goodson, J. Appl. Phys. 90, 763 (2001).
23. K. E. Goodson, M. I. Flik, L. T. Su, and D. A. Antoniadis, J. Heat Transfer 116, 317 (1994).
24. B. Behkam, Y. Yang, and M. Asheghi, Proceedings of the ASME International Mechanical Engineering Conference and R&D Exposition, Washington, DC., USA, 15-21 November 2003, Paper IMECE-41626.
25. C. T. Li, Y. Yang, S. M. Sadeghipour, and M. Asheghi, Proceedings of the ASME International Mechanical Engineering Conference and R&D Exposition, Anaheim, CA, USA, 13-19 November 2004, Paper IMECE-62150.
26. M. N. Touzelbaev and K. E. Goodson, Int. J. Thermophys. 22, 243 (2001).
27. O. W. Kading, H. Skurk, and K. E. Goodson, Appl. Phys. Lett. 65, 1629 (1994).
28. E. T. Swartz and R. O. Pohl, Appl. Phys. Lett. 51, 2200 (1987).
29. G. A. Slack, Phys. Rev. B 6, 3791 (1972).
30. D. G. Cahill and R. O. Pohl, Phys. Rev. B 35, 4067 (1987).
31. E.-K. Kim, S.-I. Kwun, S.-M. Lee, H. Seo, and J.-G. Yoon, Phys. Rev. B 61, 6036 (1997).
32. D. G. Cahill and R. O. Pohl, Annu. Rev. Phys. Chem. 39, 93 (1988).
33. L. C. Davis and B. E. Artz, J. Appl. Phys. 77, 4954 (1995).
34. C.-W. Nan, R. Birringer, D. R. Clarke, and H. Gleiter, J. Appl. Phys. 81, 6692 (1997).
35. J. M. Yáñez-Limón, J. Gonżalez-Hernández, J. J. Alvarado-Gil, I. Delgadillo, and H. Vargas, Phys. Rev. B 52, 16321 (1995).