A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies

IEEE Transactions on Microwave Theory and Techniques

Volumn 54, Issue 7, 2006, Pages 2925-2934

  Lee, Jong Hoon ^a,b   Kidera, Nobutaka ^c   DeJean, Gerald ^a,b   Pinel, Stéphane ^a,b   Laskar, Joy ^a,b   Tentzeris, Manos M ^a,b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c ASAHI GLASS CO LTD   (Japan)

Author keywords

Bandpass filter (BPF); Cavity filters; Dual band antenna; Duplexer; Front end module; Integrated passives; Low temperature co fired ceramic (LTCC); Millimeter wave; Patch antenna; System on package (SOP); Three dimensional (3 D) integration; Transceiver; V band

Indexed keywords

CAVITY FILTERS; DUAL-BAND ANTENNAS; DUPLEXER; FRONT-END MODULE; INTEGRATED PASSIVES; LOW-TEMPERATURE CO-FIRED CERAMIC (LTCC); PATCH ANTENNA; SYSTEM-ON-PACKAGE (SOP); THREE-DIMENSIONAL (3-D) INTEGRATION; V-BAND;

ANTENNA ARRAYS; COMPUTER SIMULATION; MILLIMETER WAVES; NATURAL FREQUENCIES; SENSORS; TRANSCEIVERS; WIRELESS TELECOMMUNICATION SYSTEMS;

BANDPASS FILTERS;

EID: 33746409154     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2006.877440     Document Type: Article

References (21)

1. C. H. Doan, S. Emami, D. A. Sobel, A. M. Niknejad, and R. W. Brodersen, "Design considerations for 60 GHz CMOS radios," IEEE Commun. Mag., vol. 42, no. 12, pp. 132-140, Dec. 2004.
2. K. Kornegay, "60 GHz radio design challenges," in GaAs IC Symp. Dig., San Diego, CA, Nov. 2003, pp. 89-92.
3. Y. Takimoto, H. Yatsuka, A. Inoue, T. Yokoyama, T. Aoyagi, K. Ohata, T. Saito, T. Negishi, and N. Okubo, in IEEE MTT-S Int. Microw. Symp. Dig., San Francisco, CA, Jun. 1996, pp. 509-512.
4. J.-H. Lee, G. DeJean, S. Sarkar, S. Pinel, K. Lim, J. Papapolymerou, J. Laskar, and M. M. Tentzeris, "Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology," IEEE Trans. Microw. Theory Tech., vol. 53, no. 6, pp. 2220-2229, Jun. 2005.
5. Y. C. Lee, W.-I. Chang, Y. H. Cho, and C. S. Park, "A very compact 60 GHz transmitter integrating GaAs MMICs on LTCC passive circuits for wireless terminals applications," in IEEE MTT-S Int. Microw. Symp. Dig, Fort Worth, TX, Oct. 2004, pp. 313-316.
6. K. Ohata, T. Inoue, M. Funabashi, A. Inoue, Y. Takimoto, T. Kuwabara, S. Shinozaki, K. Maruhashi, K. Hosaya, and H. Nagai, "60-GHz-band ultra-miniature monolithic T/R modules for multimedia wireless communication systems," IEEE Trans. Microw. Theory Tech., vol. 44, no. 12, pp. 2354-2360, Dec. 1996.
7. K. Ohata, K. Maruhashi, M. Ito, S. Kishimoto, K. Ikuina, T. Hashiguchi, K. Ikeda, and N. Takahashi, "1.25 Gbps wireless gigabit ethernet link at 60 GHz-band," in IEEE MTT-S Int. Microw. Symp. Dig, Philadelphia, PA, Jun. 2003, pp. 373-376.
8. J. Mizoe, S. Amano, T. Kuwabara, T. Kaneko, K. Wada, A. Kato, K. Sato, and M. Fujise, "Miniature 60 GHz transmitter/receiver modules on AIN multi-layer high temperature co-fired ceramic," in IEEE MTT-S Int. Microw. Symp. Dig., Anaheim, CA, Jun. 1999, pp. 475-478.
9. F. Kuroki, Y. MUrata, and T. Yoneyama, "Filter-based NRD-guide duplexer with low loss and high isolation at 60 GHz," Electron. Lett., vol. 40, no. 13, pp. 808-810, Jun. 2004.
10. T. Matsuda, J. Tsutsumi, S. Inoue, Y. Iwamoto, and Y. Sato, "High-frequency SAW duplexer with low-loss and steep cut-off characteristics," in IEEE Ultrason. Symp., Munich, Germany, Oct. 2002, pp. 71-76.
11. F. M. Pitschi, J. E. Kiwitt, B. Bader, and K. C. Wagner, "On the design of an FBAR PCS duplexer in LTCC chip-sized package," in IEEE Ultrason. Symp., Montreal, QC, Canada, Aug. 2004, pp. 1525-1528.
12. S. Marksteiner, M. Handtmann, H.-J. Timme, and R. Aigner, "A miniature BAW duplexer using flip-chip on LTCC," in IEEE Ultrason. Symp., Honolulu, HI, Oct. 2003, pp. 1794-1797.
13. L. Harle and L. P. B. Katehi, "A vertically integrated micromachined filter," IEEE Trans. Microw. Theory Tech., vol. 50, no. 9, pp. 2063-2068, Sep. 2002.
14. J.-H. Lee, N. Kidera, S. Pinel, J. Papapolymerou, J. Laskar, and M. M. Tentzeris, "A highly integrated 3-D millimeter-wave filter using LTCC system-on-package (SOP) technology for V-band WLAN gigabit wireless systems," in Proc. 17th Asia-Pacific Microw. Conf., Suzhou, China, 2005, pp. 3-5.
15. R. E. Collin, Foundations for Microwave Engineering. New York: McGraw-Hill, 1992.
16. M. J. Hill, R. W. Ziolkowski, and J. Papapolymerou, "Simulated and measured results from a Duroid-based planar MBG cavity resonator filter," IEEE Microw. Wireless Compon. Lett., vol. 10, no. 12, pp. 528-530, Dec. 2000.
17. J.-H. Lee, S. Pinel, J. Papapolymerou, J. Laskar, and M. M. Tentzeris, "Low loss LTCC cavity filters using system-on-package technology at 60 GHz," IEEE Trans. Microw. Theory Tech., vol. 53, no. 12, pp. 231-244, Dec. 2005.
18. D. M. Pozar, Microwave Engineering, 2nd ed. New York: Wiley, 1998.
19. J.-S. Hong and M. J. Lancaster, Microstrip Filters for RF/Microwave Applications. New York: Wiley, 2001.
20. J. Heyen, A. Gordiyenko, P. Heide, and A. F. Jacob, "Vertical feedthroughs for millimeter-wave LTCC modules," in IEEE Eur: Microw. Conf., Munich, Germany, Oct. 2003, pp. 411-414.
21. D. C. Thomson, O. Tantot, H. Jallageas, G. E. Ponchak, M. M. Tentzeris, and J. Papapolymerou, "Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz," IEEE Trans. Microw. Theory Tech., vol. 52, no. 4, pp. 1343-1352, Apr. 2004.