Low-loss LTCC cavity filters using system-on-package technology at 60 GHz

IEEE Transactions on Microwave Theory and Techniques

Volumn 53, Issue 12, 2005, Pages 3817-3824

  Lee, Jong Hoon ^a,b,c,d,e   Pinel, Stephane ^a,b,c   Papapolymerou, John ^a,b,f   Laskar, Joy ^{a,b,c,d,e,g,h}   Tentzeris, Manos M ^a,b,c,d,i,j  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^d NATIONAL SCIENCE FOUNDATION   (United States)

^e Electronic Design

^f URSI   (United States)

^g Georgia Institute of Technology ^*

^h Georgia's Electronic Design Center   (Georgia)

ⁱ RF Research

^j TECHNICAL CHAMBER OF GREECE   (Greece)

more..

Author keywords

Bandpass filter (BPF); Cavity filters; Cavity resonators; Low temperature cofired ceramic (LTCC); Millimeter wave; System on package (SOP); Three dimensional (3 D) integration

Indexed keywords

CAVITY FILTERS; LOW-TEMPERATURE COFIRED CERAMICS (LTCC); SYSTEM-ON-PACKAGE (SOP); THREE-DIMENSIONAL (3D) INTEGRATION;

BANDPASS FILTERS; CAVITY RESONATORS; CERAMIC MATERIALS; ELECTRONICS PACKAGING; MILLIMETER WAVES; NATURAL FREQUENCIES;

LOW PASS FILTERS;

EID: 29544452491     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2005.859864     Document Type: Article

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