A highly integrated 3-D millimeter-wave filter using LTCC system-on-package (SOP) technology for V-band WLAN gigabit wireless systems

Asia-Pacific Microwave Conference Proceedings, APMC

Volumn 1, Issue , 2005, Pages

  Lee, J H ^a   Kidera, N ^b   Pinel, S ^a   Papapolymerou, J ^a   Laskar, J ^a   Tentzeris, M M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b ASAHI GLASS CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; LOCAL AREA NETWORKS; LOW TEMPERATURE OPERATIONS; MILLIMETER WAVES; RESONATORS; WIRELESS TELECOMMUNICATION SYSTEMS;

LTCC; STACKED CAVITY EMBEDDED FILTERS; SYSTEM ON PACKAGE (SOP); V-BAND WLAN GIGABIT WIRELESS SYSTEMS;

MICROWAVE FILTERS;

EID: 33847141023     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APMC.2005.1606286     Document Type: Conference Paper

References (6)

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