Multi-objective module placement for 3-D system-on-package

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volumn 14, Issue 5, 2006, Pages 553-557

  Wong, Eric ^a   Minz, Jacob ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Floorplanning; Thermal via; Three dimensional (3 D) ICs

Indexed keywords

ADAPTIVE ALGORITHMS; MICROPROCESSOR CHIPS; OPTIMIZATION; POWER SUPPLY CIRCUITS; SIGNAL PROCESSING; SPURIOUS SIGNAL NOISE;

FLOORPLANNING; MULTI OBJECTIVE MODULES; THERMAL VIA; THREE-DIMENSIONAL (3-D) IC;

ELECTRONICS PACKAGING;

EID: 33746391543     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/TVLSI.2006.876111     Document Type: Article

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