Process windows for low-temperature Au wire bonding

Journal of Electronic Materials

Volumn 33, Issue 2, 2004, Pages 146-155

  Chan, Yu Hin ^a   Kim, Jang Kyo ^a   Liu, Deming ^b   Liu, Peter C K ^b   Cheung, Yiu Ming ^b   Ng, Ming Wai ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Bond pad; Process window; Pull strength; Wire bond

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; CHARACTERIZATION; DEFORMATION; ELECTROPLATING; GOLD; HIGH TEMPERATURE EFFECTS; LOW TEMPERATURE EFFECTS; MECHANICAL VARIABLES MEASUREMENT; METALLIZING; PRINTED CIRCUIT BOARDS; STRENGTH OF MATERIALS;

BOND PAD; BOND PAD METALLIZATION; PROCESS WINDOW; PULL STRENGTH; WIRE BOND; WIRE BONDABILITY;

WIRE;

EID: 1542336717     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0285-5     Document Type: Article

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