Gold wire bonding onto flexible polymeric substrates

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 1, 1996, Pages 12-17

  Hall, Elizabeth ^a   Lyons, Alan M ^a   Weld, John D ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

Adhesiveless; Chip on flex; Liquid crystalline polymer; Polyether imide; Polyimide

Indexed keywords

CLADDING (COATING); COPPER; ELECTRIC RESISTANCE; ENCAPSULATION; GLASS FIBER REINFORCED PLASTICS; LAMINATING; LIQUID CRYSTAL POLYMERS; POLYETHERIMIDES; POLYIMIDES; POLYTETRAFLUOROETHYLENES; SUBSTRATES; THERMAL CYCLING;

CHIP ON FLEX CIRCUITS; GOLD WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 0030108030     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.486556     Document Type: Article

References (13)

1. E. Newcombe, "Design tradeoffs when using SMT, COB, and/or TAB packaging technologies," in Proc. IEEE/CHMT Int. Electron. Manufact. Technol. Symp., 1992, p. 343.
2. D. Robinson, E. Mammo, L. Higgins, and J. Baum, "Glob top encapsulation of large die on MCM-L," Int. J. Microcircuits Electron. Packaging, vol. 15, no. 4, 1992, p. 213.
3. P. Sarbach, L. Guerin, A. Weber, M. Dutoit, and P. Clot, "Stress analysis and reliability of chip on board encapsulation technology," in Proc. IEEE/CHMT Int. Electron. Manufact. Technol. Symp., 1993, p. 82.
4. C. S. Milkovich, M. A. Gaynes, and J. S. Perkins, "Double sided flexible carrier with discretes and thermally enhanced FCA/COF," in Proc. 44th ECTC, 1993, p. 16.
5. O. Atsushi, N. Oyama, and T. Hashimoto, "New metal board for COB, multi-chip module, TAB and flip-chip," in Proc. 44th ECTC, p. 555.
6. K. Ramakrishan, J. C. Lo, and Y. Guo, "An assessment of mechanical reliability of a die-bonded chip package during chip encapsulation and accelerated thermal cycling," in Proc. 44th ECTC, p. 670.
7. A. S. Chen, L. T. Nguyen, T. S. Burke, and J. G. Belani, "Wire bonding: Present and future trends," in Proc. IEEE/CHMT Int. Electron. Manufact. Technol. Symp., 1993, p. 45.
8. K. Takeda, M. Ohmasa, N. Kurosu, and J. Hosaka, "Ultrasonic wire bonding using gold plated copper wire onto flexible printed circuit board," in Proc. IMC, 1994, p. 173.
9. K. J. Ely and M. D. Randell, "Soft substrates - A wire bond reliability study," in Proc. ISHM, 1985, p. 420.
10. R. L Shook, "Thermosonic wire bonding on to single layer polymer hybrid integrated circuits (PolyHICs)," Hybrid Circuits, vol. 13, May 1987, p. 36.
11. G. S. Heinen, R. J. Stierman, D. Edward, L. Nye, "Wire bonds over active circuits," in Proc. 44th ECTC, 1994, p. 922.
12. V. Murali, M. Gasparetk, A. Bahansali, S. H. Chen, and R. Dais, "Wirebonding of aluminum/polyimide multilayer structures," in Proc. 30th IRPS, 1992, pp. 24-30.
13. E. Giani, J. P. Mathurin, "Quality issues in chip-on-board (COB) technology," Hybrid Circuits, no. 34, May 1994, p. 5.