Effects of plasma cleaning on the reliability of wire bonding

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 39-43

  Nowful, J M ^a   Lok, S C ^a   Ricky Lee, S W ^b  

^a ASAT   (Hong Kong)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHARACTERIZATION; CLEANING; CONTACT ANGLE; ELECTRONICS PACKAGING; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; RELIABILITY; SHEAR FLOW;

BALL SHEAR STRENGTH; PARAMETER-TUNING; PLASMA CLEANING; PROCESSING PARAMETERS; PULL STRENGTH; SURFACE CHARACTERISTICS; WIRE BONDING; WIRE BONDS;

WIRE;

EID: 84960387718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983955     Document Type: Conference Paper

References (8)

1. nd edition, McGraw-Hill (New York, 1997)
2. Cai, J., Lee, S.-W.R., Lau, D. and Leuenberger, E., "Effects of Surface Characteristics on the Bondability of PBGA Soft Au Wire Bond Pad," Proc. 3rd International Symposium on Electronic Packaging Technology (ISEPT), Beijing, China, August 1998, pp. 176-181.
3. James L. Jellison, "Kinetics of Thermo-compression Bonding to Organic Contaminated Gold Surfaces," Proc. Electronic Components Conference, 1976, pp. 92-97.
4. Bushmire, D. W. and Holloway, P. H., "The Correlation between Bond Reliability and Solid Phase Bonding Techniques for Contaminated Bonding Surfaces," Proc. International Microelectronics Symposium (ISHM), Orlando, Florida, October 1975, pp. 402-407.
5. Nico Onda, Zeno stossel, Alex Dommann and Jurgen Ramm, "DC Hydrogen Plasma Cleaning: A Novel Process for IC Packaging," Proc. Semicon-West, San Jose CA, July 1997.
6. Schneuwly, P.Groning, L.Schlapbach, and V.P.Jackelin, "Influence of Surface Contamination on Metal/Metal Bond Contact Quality," Journal of Electronic Materials, Vol. 27, No. 8 (1998), pp. 990-999.
7. Dini, J. W., and Johnson, H. R., "Influence of Codeposited Impurities on Thermo-compression Bonding of Electroplated Gold," Thin Solid Films, Vol. 45 (1977), pp. 59-68.
8. Casey, D. J., and Endicott, D. W., "Control of Surface Quality of Gold Electrodeposits Utilizing Auger Electron Spectroscopy," Plating and Surface Finishing, Vol. 67 (1980), pp. 39-42.