SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 30, Issue 8, 2001, Pages 1001-1011

Effects of metallization characteristics on gold wire bondability of organic printed circuit boards

(2) Kim, Jang Kyo a Au, Benny P L a

a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Hong Kong)

Author keywords

Au Ni bond pad; Plasma treatment; Surface characteristics; Wire bonding

Indexed keywords

ATOMIC FORCE MICROSCOPY; BONDING; GOLD; METALLIZING; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

WIRE BONDING;

PRINTED CIRCUIT BOARDS;

EID: 0035415836 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/BF02657725 Document Type: Article

Times cited : (28)

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