A study on the reliability of indium solder die bonding of high power semiconductor lasers

Journal of Applied Physics

Volumn 100, Issue 1, 2006, Pages

  Liu, Xingsheng ^a   Davis, Ronald W ^a   Hughes, Lawrence C ^a   Rasmussen, Michael H ^a   Bhat, Rajaram ^a   Zah, Chung En ^a   Stradling, Jim ^b  

^a Science and Technology Division   (United States)

^b Matec Micro Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATASTROPHIC OPTICAL MIRROR DAMAGE (COMD); DIE BONDING; INDIUM SOLDERS; SOLDER BONDED DEVICES;

ACOUSTIC MICROSCOPES; CRYSTALLIZATION; CURRENT DENSITY; DEGRADATION; ELECTROMIGRATION; FAILURE ANALYSIS; INDIUM; OPTICAL MICROSCOPY; SOLDERING ALLOYS; THERMAL EFFECTS;

SEMICONDUCTOR LASERS;

EID: 33746191719     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2209194     Document Type: Article

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