A novel thermal-bubble-based micromachined accelerometer

Sensors and Actuators, A: Physical

Volumn 130-131, Issue SPEC. ISS., 2006, Pages 282-289

  Liao, Ke Min ^a   Chen, Rongshun ^a   Chou, Bruce C S ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Heat transfer; Micromachined accelerometer; Temperature sensor; Thermal bubble

Indexed keywords

COMPUTER SIMULATION; FLOW OF FLUIDS; HEAT TRANSFER; MICROMACHINING; PHYSICAL PROPERTIES; VAPORS;

MICROMACHINED ACCELEROMETERS; TEMPERATURE SENSORS; THERMAL-BUBBLE;

ACCELEROMETERS;

EID: 33745835409     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.02.049     Document Type: Article

References (16)

1. Mineta T., Kobayashi S., Watanabe Y., Kanauchi S., Nakagawa I., Wuganuma E., and Esashi M. Three-axis capacitive accelerometer with uniform axial sensitivities. J. Micromech. Microeng. 6 (1996) 431-435
2. Spangler L.C., and Kemp C.J. ISAAC: integrate silicon automotive accelerometer. Sens. Actuators A 54 (1996) 523-529
3. Belloy E., Sayah A., and Gijs M.A.M. Micromachining of glass inertial sensors. J. Microelectromech. Syst. 11 (2002) 85-90
4. Roylance L.M., and Angell J.B. A batch-fabricated silicon accelerometer. IEEE Trans. Electron. Devices ED-26 (1979) 1911-1917
5. Partridge A., Reynolds J.K., Chui B.W., Chow E.M., Fitzgerald A.M., Zhang L., Maluf N.I., and Kenny T.W. A high-performance planar piezoresistive accelerometer. J. Microelectromech. Syst. 9 (2000) 58-66
6. Zavaracky P.M., McClelland B., Warner K., Wang J., Hartley F., and Dolgin B. Design and process considerations for a tunneling tip accelerometer. J. Micromech. Microeng. 6 (1996) 352-358
7. Dauderstadt U.A., Vries P.H.S., Hiratsuka R., and Sarro P.M. Silicon accelerometer based on thermopiles. Sens. Actuators A 46 (1995) 201-204
8. Dauderstadt U.A., Sarro P.M., and French P.J. Temperature dependence and drift of a thermal accelerometer. Sens. Actuators A 66 (1998) 244-249
9. R. Dao, D.E. Morgan, H.H. Kries, D.M. Bachelder, Convective Accelerometer and Inclinometer, United States Patent #5,581,034, REMEC, Inc., 1996.
10. Leung A.M., Jones J., Czyzewska E., Chen J., and Pascal M. Micromachined accelerometer with no proof mass. Tech. Digest Int. Electron Device Meet (1997) 899-902
11. Milanovic V., Bowen E., Tea N., Suehle J.S., Payne B., Zaghloul M.E., and Gaitan M. Convection-based accelerometer and tilt sensor implemented in standard CMOS. MEMS Symp. Int. Mech. Eng. Exposition (1998) 627-630
12. Luo X.B., Li Z.X., Guo Z.Y., and Yang Y.J. Thermal optimization on micromachined convective accelerometer. Heat Mass Transfer 38 (2002) 705-712
13. Billat S., Glosch H., Kunze M., Hedrich F., Frech J., Auber J., Sandmaier H., Wimmer W., and Lang W. Micromachined inclinometer with high sensitivity and very good stability. Sens. Actuators A 97-98 (2002) 125-130
14. Lin L., Pisano A.P., and Carey V.P. Thermal bubble formation on polysilicon micro resistors. ASME J. Heat Transfer 120 (1998) 735-742
15. Tsai J.H., and Lin L. Transient Thermal bubble formation on polysilicon micro-resistors. ASME J. Heat Transfer 124 (2002) 375-382
16. Liao K.M., Chen R., and Chou B.C.S. Design and analysis of thermal-bubble-based micromachined accelerometers. 7th Biennial ASME Conference Engineering System Design and Analysis. Manchester, UK (2004)