Warpage minimization of the HVQFN map mould

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 168-174

  Beijer, J G J ^a   Janssen, J H J ^b   Bressers, H J L ^b   Van Driel, W D ^b   Jansen, K M B ^c   Yang, D G ^c   Zhang, G Q ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; PROCESS ENGINEERING; SHRINKAGE; THERMAL EXPANSION; VISCOELASTICITY;

HVQFN MAP; POST MOULD CURING (PMC); RESPONSE SURFACE MODEL; WARPAGE;

MOLDS;

EID: 33745698153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502794     Document Type: Conference Paper

References (9)

1. HVQFN™, Amkor Technology Inc., Chandler, USA.
2. D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Dressera, X.J. Fan, "Prediction of Process-Induced Warpage of IC Packages Encapsulated with Thermosetting Polymers", Proc ECTC 2004, p. 98-105.
3. D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, "Modeling of Cure-Induced Warpage of Plastic IC Packages", Proc EuroSimE 2004, pp. 33-40.
4. Jansen, K.M.B., Wang, L., van 't Hof, C., Ernst, L.J., Bressers, H.J.L., Zhang, G.Q., "Cure, temperature and time dependent constitutive modeling of moulding compounds", Proc EuroSimE 2004, p. 581-585.
5. Jansen, K.M.B., Wang, L., Yang, D.G., van't Hof, C., Ernst, L.J., Bressers, H.J.L., Zhang, G.Q., "Constitutive modeling of moulding compounds", Proc ECTC 04, p. 890-894.
6. van 't Hof, C., Wisse, G., Ernst, L.J., Jansen, K.M.B., Yang, D.G., Zhang, G.Q., Bressers, H.J.L., "A novel tool for cure dependent viscoelastic characterization of packaging polymers", Proc EuroSimE 2004, p. 385390.
7. G.Q. Zhang, "The challenges of virtual prototyping and qualification for future microelectronics"; Microelectronics Reliability, 43., 2003, pp. 1777-1785.
8. D.G.Yang, et al, "Parameter sensitivity study of cure-dependent underfill properties on Flip Chip failures", Proc 52th Electronic Components and Technology Conference, San Diego, May 28-31, 2002, pp. 865-872.
9. OPTIMUS Version 5.0, optimisation software tool, Noesis Inc., Manual, 2005.