65 nm photolithography process window qualification study with advanced e- beam metrology and inspection systems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6152 II, Issue , 2006, Pages

  Hsu, Ruei Hung ^a   Lin, Benjamin Szu Min ^a   Wu, Wei Yih ^b   Xiao, Hong ^c   Jau, Jack ^c  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b Hermes Systems   (Taiwan)

^c Hermes Microvision Inc   (United States)

Author keywords

And gray level value (GLV); Critical dimension (CD); Dark voltage contrast (DVC); Focus exposure matrix (FEM); Process window qualification (PWQ)

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ELECTRIC POTENTIAL; INSPECTION; SILICON WAFERS; STATIC RANDOM ACCESS STORAGE; TUNGSTEN;

AND GRAY LEVEL VALUE (GLV); CRITICAL DIMENSION (CD); DARK VOLTAGE CONTRAST (DVC); FOCUS EXPOSURE MATRIX (FEM); PROCESS WINDOW QUALIFICATION (PWQ);

MASKS;

EID: 33745633317     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.657356     Document Type: Conference Paper

References (6)

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