In-line high-resistance tungsten plug defect monitoring with an advanced e-beam system

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2005, Issue , 2005, Pages 448-450

  Liu, Hermes ^a   Yeh, J H ^a   Tsai, Mingsheng ^a   Lin, Scott ^a   Wang, Kirin ^a   Lei, Shuen Chen ^a   Wu, Wei Yih ^b   Wu, Hong Chi ^b   Xiao, Hong ^c   Jau, Jack ^c  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b Hermes Systems   (Taiwan)

^c Hermes Microvision Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON BEAMS; MONITORING; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

DARK VOLTAGE CONTRAST (DVC); GRAY LEVEL VALUES (GLV); W-PLUGS;

ELECTRIC RESISTANCE;

EID: 33645652346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

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2. Electrical Defect SEM Review under the Various Electrical Circumstance on SAC layer. Jong II Choi, Seo Shik Hur, Ki Hwa Ko, Jeong-Ho Yeo* Applied Materials, Korea (PDC), Applied Materials, Israel*
3. Characterization of Copper Voids in Damascene Processes Richard L. Guldi, Member, IEEE, Judy B. Shaw, Jeffrey Ritchison, Daniel L. Corum, Steven Oestreich, Kara Sherman, Jason H. Lin, and Robert Fiordalice, Member, IEEE, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 17, NO. 4, NOVEMBER 2004
4. X. Liu, X, Zhang, Y. Zhao, A. Desai, and Z. W. Chen, "Low energy large scan field electron beam column for wafer inspection", J. Vac. Sci. Tech. B, 22, pp.3534-3538, 2004