Post-WCMP leakage detection and monitoring on 65-nm devices using an advanced e-beam inspection system

IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Volumn , Issue , 2005, Pages 472-475

  Wang, Kirin ^a   Liu, Hermes ^a   Yeh, J H ^a   Tsai, Mingsheng ^a   Wu, Wei Yih ^b   Wu, Hong Chi ^b   Xiao, Hong ^c   Jau, Jack ^c  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b Hermes Systems   (Taiwan)

^c Hermes Microvision Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DIFFUSION; ELECTRON BEAMS; INSPECTION; NICKEL COMPOUNDS; TUNGSTEN;

65-NM DEVICES; LEAKAGE DETECTION; TUNGSTEN CHEMICAL MECHANICAL POLISHING (WCMP); WAFER ACCEPTANCE TESTS (WAT);

SEMICONDUCTOR JUNCTIONS;

EID: 28744433896     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/issm.2005.1513409     Document Type: Conference Paper

References (5)

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4. X. Liu, X, Zhang, Y. Zhao, A. Desai, and Z. W. Chen, "Low energy large scan field electron beam column for wafer inspection", J. Vac. Sci. Tech. B, 22, pp.3534-3538, 2004
5. Lreimer, "Scanning Electron Microscopy, Physics of Image Formation and Microanalysis", Second Edition, Springer, New York, 1998.