Three-wavelength electronic speckle pattern interferometry with the Fourier-transform method for simultaneous measurement of microstructure-scale deformations in three dimensions

Applied Optics

Volumn 45, Issue 14, 2006, Pages 3218-3225

  Flynn, Eric B ^a   Bassman, Lori C ^a   Smith, Timothy P ^a   Lalji, Zamir ^a   Fullerton, Laurel H ^a   Leung, Tommy C ^a   Greenfield, Scott R ^b   Koskelo, Aaron C ^b  

^a HARVEY MUDD COLLEGE   (United States)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COLOR; DEFORMATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MICROSTRUCTURE; MOIRE FRINGES; SPECKLE;

ELECTRONIC SPECKLE PATTERN INTERFEROMETRY; IN-PLANE DEFORMATION MEASUREMENT; MICROSTRUCTURAL DEFORMATIONS; THREE-DIMENSIONAL DEFORMATIONS;

INTERFEROMETRY;

ALGORITHM; ARTICLE; COMPUTER ASSISTED DIAGNOSIS; ELASTICITY; FOURIER ANALYSIS; IMAGE ENHANCEMENT; INTERFEROMETRY; MATERIALS TESTING; MECHANICAL STRESS; METHODOLOGY; REFRACTOMETRY; REPRODUCIBILITY; SENSITIVITY AND SPECIFICITY; THREE DIMENSIONAL IMAGING;

ALGORITHMS; ELASTICITY; FOURIER ANALYSIS; IMAGE ENHANCEMENT; IMAGE INTERPRETATION, COMPUTER-ASSISTED; IMAGING, THREE-DIMENSIONAL; INTERFEROMETRY; MATERIALS TESTING; REFRACTOMETRY; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY; STRESS, MECHANICAL;

EID: 33745632428     PISSN: 1559128X     EISSN: 15394522     Source Type: Journal    
DOI: 10.1364/AO.45.003218     Document Type: Article

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