Morphology, growth and size distribution of Cu 6Sn 5 intermetallic compound by flux-driven ripening at SnPb solder and Cu interface

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 27-32

  Suh, J O ^a   Tu, K N ^a   Gusak, A M ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b CHERKASY NATIONAL UNIVERSITY   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

CUBE ROOT; FLUX DRIVEN RIPENING (FDR); GROWTH RATE; SIZE DISTRIBUTION;

COPPER; EUTECTICS; GROWTH KINETICS; INTERFACES (MATERIALS); MORPHOLOGY; SOLDERING ALLOYS; TIN;

INTERMETALLICS;

EID: 33746515606     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432040     Document Type: Conference Paper

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