Bi-stable micro actuator based on stress engineered nano-diamond

Diamond and Related Materials

Volumn 15, Issue 4-8, 2006, Pages 773-776

  Kusterer, J ^a   Hernandez, F J ^a   Haroon, S ^a   Schmid, P ^a   Munding, A ^a   Muller R ^a   Kohn, E ^a  

^a UNIVERSITY OF ULM   (Germany)

Author keywords

Actuators; Hot filament CVD; Micro electro mechanical systems (MEMS); Nanocrystalline

Indexed keywords

CANTILEVER BEAMS; METALS; MICROACTUATORS; SEMICONDUCTING DIAMONDS;

HOT FILAMENT CVD; HYBRID INTEGRATION; METAL ACTUATORS; MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS);

NANOSTRUCTURED MATERIALS;

EID: 33745252535     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2005.11.054     Document Type: Article

References (5)

1. Schmid P., Hernandez-Guillen F.J., and Kohn E. Diamond and Related Materials 12 (2003) 418
2. Janischowsky K., Ebert W., and Kohn E. Diamond and Related Materials 12 (2003) 336
3. Hernández Guillén F.J., Janischowsky K., Kusterer J., Ebert W., and Kohn E. Diamond and Related Materials 14 (2005) 411
4. Müller R., Gronmaier R., Janischowsky K., Kusterer J., and Kohn E. Diamond and Related Materials 14 (2005) 504
5. P. Benkart, A. Kaiser, A. Munding, M. Bschorr, H.-J. Pfleiderer, A. Heittmann, H. Huebner, U. Ramacher, E. Kohn, IEEE design and test of computers, 22 (accepted for publication), "3D chip stack technology using through chip interconnects".