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Journal of Optics A: Pure and Applied Optics

Volumn 8, Issue 7, 2006, Pages

A multi-chip directly mounted 512-MEMS-mirror array module with a hermetically sealed package for large optical cross-connects

(8) Mi, Xiaoyu a Soneda, Hiromitsu a Okuda, Hisao a Tsuboi, Osamu a Kouma, Norinao a Mizuno, Yoshihiro a Ueda, Satoshi a Sawaki, Ippei a

a FUJITSU LABORATORIES LTD (Japan)

Author keywords

3D micro mirror; Deep reactive ion etch (DRIE) technology; Large optical cross connects; Microelectromechanical (MEMS) devices; Multi chip direct mounting (MCDM) technology; Photonic switching system

Indexed keywords

ELECTRONICS PACKAGING; HERMETIC DEVICES; HERMETIC SEALS; NATURAL FREQUENCIES; OPTICAL SYSTEMS; REACTIVE ION ETCHING; SWITCHING;

3D MICRO-MIRROR; DEEP REACTIVE ION ETCH (DRIE) TECHNOLOGY; LARGE OPTICAL CROSS-CONNECTS; MICROELECTROMECHANICAL (MEMS) DEVICES; MULTI-CHIP DIRECT MOUNTING (MCDM) TECHNOLOGY; PHOTONIC SWITCHING SYSTEMS;

MIRRORS;

EID: 33745183313 PISSN: 14644258 EISSN: 17413567 Source Type: Journal
DOI: 10.1088/1464-4258/8/7/S08 Document Type: Article

Times cited : (12)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.